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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-3501-30

18-3501-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

2309 QRF
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18-3501-30

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0511-10

11-0511-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

2186 QRF
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11-0511-10

Datasheet

Bulk 511 Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-1518-11

40-1518-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2003 QRF
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40-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-112

16-3518-112

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3454 QRF
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16-3518-112

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-102

24-3518-102

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3264 QRF
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24-3518-102

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-316-T-P

APA-316-T-P

ADAPTER PLUG

Samtec Inc.

3955 QRF
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Bag APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
14-3503-30

14-3503-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3985 QRF
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14-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-656-41-005000

117-43-656-41-005000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.

2060 QRF
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117-43-656-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-135-14-051101

510-83-135-14-051101

CONN SOCKET PGA 135POS GOLD

Preci-Dip

2344 QRF
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510-83-135-14-051101

Datasheet

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-3513-10

36-3513-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3540 QRF
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36-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-102

24-6518-102

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2668 QRF
- +

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24-6518-102

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-318-G-J

APA-318-G-J

ADAPTER PLUG

Samtec Inc.

2719 QRF
- +

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Tube APA Active - 18 (2 x 9) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
714-43-125-31-018000

714-43-125-31-018000

CONN SOCKET SIP 25POS GOLD

Mill-Max Manufacturing Corp.

3594 QRF
- +

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714-43-125-31-018000

Datasheet

Bulk 714 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-137-41-013000

346-93-137-41-013000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.

3811 QRF
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346-93-137-41-013000

Datasheet

Bulk 346 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-137-41-013000

346-43-137-41-013000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.

2274 QRF
- +

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346-43-137-41-013000

Datasheet

Bulk 346 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
06-3503-21

06-3503-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3935 QRF
- +

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06-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-3503-31

06-3503-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2855 QRF
- +

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06-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-6823-90T

08-6823-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2468 QRF
- +

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08-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
510-83-144-12-000101

510-83-144-12-000101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3778 QRF
- +

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510-83-144-12-000101

Datasheet

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-13-001101

510-83-144-13-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3484 QRF
- +

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510-83-144-13-001101

Datasheet

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED