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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-9513-10

30-9513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2972 QRF
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30-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-11

24-3513-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3347 QRF
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24-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-41-304-41-001000

115-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3817 QRF
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115-41-304-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-304-41-001000

115-91-304-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

3043 QRF
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115-91-304-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-6511-11

08-6511-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3763 QRF
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08-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-133-14-071101

510-83-133-14-071101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

3689 QRF
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510-83-133-14-071101

Datasheet

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-17-001101

510-87-225-17-001101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

3153 QRF
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510-87-225-17-001101

Datasheet

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-17-061101

510-87-225-17-061101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2700 QRF
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510-87-225-17-061101

Datasheet

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-15-000101

510-87-225-15-000101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2043 QRF
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510-87-225-15-000101

Datasheet

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-18-019101

510-87-225-18-019101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2112 QRF
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510-87-225-18-019101

Datasheet

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-004101

116-83-632-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2430 QRF
- +

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116-83-632-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-0501-31

08-0501-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3814 QRF
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08-0501-31

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-93-304-41-105000

110-93-304-41-105000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3783 QRF
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110-93-304-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-304-41-105000

110-43-304-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3471 QRF
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110-43-304-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-328-41-013101

116-83-328-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2006 QRF
- +

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116-83-328-41-013101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-013101

116-83-428-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3615 QRF
- +

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116-83-428-41-013101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-013101

116-83-628-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2060 QRF
- +

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116-83-628-41-013101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
40-6511-10

40-6511-10

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

3456 QRF
- +

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40-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6823-90T

10-6823-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3098 QRF
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10-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-3501-20

18-3501-20

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3120 QRF
- +

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18-3501-20

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED