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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-7750-10

08-7750-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

3766 QRF
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08-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-7950-10

08-7950-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

2696 QRF
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08-7950-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-7955-10

08-7955-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

2182 QRF
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08-7955-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-7970-10

08-7970-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

2822 QRF
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08-7970-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-7980-10

08-7980-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

3566 QRF
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08-7980-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-422-T-C

APA-422-T-C

ADAPTER PLUG

Samtec Inc.

3364 QRF
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Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-640-41-004101

116-87-640-41-004101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2123 QRF
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116-87-640-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-13-041101

510-83-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

2522 QRF
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510-83-145-13-041101

Datasheet

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-0503-20

12-0503-20

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2240 QRF
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12-0503-20

Datasheet

Bulk 0503 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
12-0503-30

12-0503-30

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3635 QRF
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12-0503-30

Datasheet

Bulk 0503 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
28-0518-00

28-0518-00

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3455 QRF
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28-0518-00

Datasheet

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-00

28-1518-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2369 QRF
- +

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28-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-11H

24-0518-11H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3482 QRF
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24-0518-11H

Datasheet

Bulk 518 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-11H

24-1518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2304 QRF
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24-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0511-11

02-0511-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3073 QRF
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02-0511-11

Datasheet

Bulk 511 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-2503-21

06-2503-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2452 QRF
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06-2503-21

Datasheet

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-2503-31

06-2503-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3043 QRF
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06-2503-31

Datasheet

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-6503-20

12-6503-20

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3859 QRF
- +

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12-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-6503-30

12-6503-30

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2167 QRF
- +

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12-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-101

32-6518-101

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3258 QRF
- +

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32-6518-101

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED