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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
38-6511-10

38-6511-10

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

3740 QRF
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38-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-101H

24-6518-101H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3418 QRF
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24-6518-101H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0517-90C

15-0517-90C

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3870 QRF
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15-0517-90C

Datasheet

Bulk 0517 Active SIP 15 (1 x 15) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-83-668-41-105101

117-83-668-41-105101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip

3097 QRF
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117-83-668-41-105101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
111-93-304-41-001000

111-93-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3875 QRF
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111-93-304-41-001000

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-304-41-105000

110-47-304-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2082 QRF
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110-47-304-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-304-41-001000

111-43-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2785 QRF
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111-43-304-41-001000

Datasheet

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-124-31-018000

714-43-124-31-018000

CONN SOCKET SIP 24POS GOLD

Mill-Max Manufacturing Corp.

3679 QRF
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714-43-124-31-018000

Datasheet

Bulk 714 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-83-764-41-105101

117-83-764-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2042 QRF
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117-83-764-41-105101

Datasheet

Bulk 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-064-08-000112

614-87-064-08-000112

CONN SOCKET PGA 64POS GOLD

Preci-Dip

3172 QRF
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614-87-064-08-000112

Datasheet

Bulk 614 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-009101

116-83-652-41-009101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3733 QRF
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116-83-652-41-009101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2T2401N

XR2T2401N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

3151 QRF
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XR2T2401N

Datasheet

Bulk XR2 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Threaded Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2T2411N

XR2T2411N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

2554 QRF
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XR2T2411N

Datasheet

Bulk XR2 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
214-44-624-01-670799

214-44-624-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3319 QRF
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Tape & Reel (TR) 214 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-99-624-01-670799

214-99-624-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2932 QRF
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Tape & Reel (TR) 214 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
116-83-648-41-001101

116-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2702 QRF
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116-83-648-41-001101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-41-304-41-105000

110-41-304-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2714 QRF
- +

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110-41-304-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-304-41-105000

110-91-304-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3463 QRF
- +

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110-91-304-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-304-41-001000

110-13-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3173 QRF
- +

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110-13-304-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-0513-11H

21-0513-11H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3475 QRF
- +

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21-0513-11H

Datasheet

Bulk 0513 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED