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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3518-101

28-3518-101

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3409 QRF
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28-3518-101

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-101

28-6518-101

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3918 QRF
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28-6518-101

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2820-90C

08-2820-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3363 QRF
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08-2820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2822-90C

08-2822-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3062 QRF
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08-2822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2823-90C

08-2823-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3222 QRF
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08-2823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-T-A1

APA-628-T-A1

ADAPTER PLUG

Samtec Inc.

2923 QRF
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Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
38-1518-11

38-1518-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2950 QRF
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38-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-320-T-N

APA-320-T-N

ADAPTER PLUG

Samtec Inc.

3980 QRF
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Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
110-11-304-41-001000

110-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3049 QRF
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110-11-304-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-135-41-013000

346-93-135-41-013000

CONN SOCKET SIP 35POS GOLD

Mill-Max Manufacturing Corp.

3305 QRF
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346-93-135-41-013000

Datasheet

Bulk 346 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-0518-11

38-0518-11

CONN SOCKET SIP 38POS GOLD

Aries Electronics

3377 QRF
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38-0518-11

Datasheet

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-11

16-C195-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2970 QRF
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16-C195-11

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-11

16-C280-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2718 QRF
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16-C280-11

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-10

24-C212-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2683 QRF
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24-C212-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-10

24-C300-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3260 QRF
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24-C300-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-101H

24-3518-101H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2250 QRF
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24-3518-101H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-10H

16-C195-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3469 QRF
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16-C195-10H

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
XR2T2421N

XR2T2421N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

2597 QRF
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XR2T2421N

Datasheet

Bulk XR2 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Threaded Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled
114-93-304-41-117000

114-93-304-41-117000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2577 QRF
- +

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114-93-304-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-304-41-117000

114-43-304-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3094 QRF
- +

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114-43-304-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED