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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-0513-10H

14-0513-10H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3760 QRF
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14-0513-10H

Datasheet

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-11H

11-0518-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3538 QRF
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11-0518-11H

Datasheet

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10

28-1518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2410 QRF
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28-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-328-41-008101

116-83-328-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3435 QRF
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116-83-328-41-008101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-15-001101

510-87-100-15-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3946 QRF
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510-87-100-15-001101

Datasheet

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-15-101101

510-87-100-15-101101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3427 QRF
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510-87-100-15-101101

Datasheet

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-008101

116-87-632-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3295 QRF
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116-87-632-41-008101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-636-31-012101

614-83-636-31-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2195 QRF
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614-83-636-31-012101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-648-41-005101

110-83-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3090 QRF
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110-83-648-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-2513-11H

06-2513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2867 QRF
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06-2513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-10T

22-4513-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3062 QRF
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22-4513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0513-11

15-0513-11

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2708 QRF
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15-0513-11

Datasheet

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
410-93-220-10-001000

410-93-220-10-001000

CONN ZIG-ZAG 20POS GOLD

Mill-Max Manufacturing Corp.

3560 QRF
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410-93-220-10-001000

Datasheet

Tube 410 Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-101-15-101101

510-87-101-15-101101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

2357 QRF
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510-87-101-15-101101

Datasheet

Bulk 510 Active PGA 101 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-006101

116-83-636-41-006101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3658 QRF
- +

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116-83-636-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-6513-11

12-6513-11

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3222 QRF
- +

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12-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0513-10

20-0513-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3137 QRF
- +

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20-0513-10

Datasheet

Bulk 0513 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0513-10T

22-0513-10T

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2017 QRF
- +

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22-0513-10T

Datasheet

Bulk 0513 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-10T

26-0518-10T

CONN SOCKET SIP 26POS GOLD

Aries Electronics

2673 QRF
- +

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26-0518-10T

Datasheet

Bulk 518 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-10T

26-1518-10T

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3314 QRF
- +

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26-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED