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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-93-620-41-005000

117-93-620-41-005000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2255 QRF
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117-93-620-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-620-41-005000

117-43-620-41-005000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2299 QRF
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117-43-620-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-650-41-001101

110-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2731 QRF
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110-83-650-41-001101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-950-41-001101

110-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2758 QRF
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110-83-950-41-001101

Datasheet

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-002101

116-87-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3598 QRF
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116-87-432-41-002101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-648-41-001101

612-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3714 QRF
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612-87-648-41-001101

Datasheet

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-642-31-012101

614-87-642-31-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3776 QRF
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614-87-642-31-012101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-018101

116-83-432-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3740 QRF
- +

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116-83-432-41-018101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-650-41-001101

614-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3371 QRF
- +

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614-87-650-41-001101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-950-41-001101

614-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3634 QRF
- +

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614-87-950-41-001101

Datasheet

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-6513-10

14-6513-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2059 QRF
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14-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6513-10T

16-6513-10T

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3390 QRF
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16-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10T

24-4518-10T

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2776 QRF
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24-4518-10T

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-11

18-0518-11

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3709 QRF
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18-0518-11

Datasheet

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-87-642-41-105101

117-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2217 QRF
- +

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117-87-642-41-105101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-095-14-091101

510-87-095-14-091101

CONN SOCKET PGA 95POS GOLD

Preci-Dip

3956 QRF
- +

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510-87-095-14-091101

Datasheet

Bulk 510 Active PGA 95 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-068-09-001101

510-83-068-09-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3131 QRF
- +

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510-83-068-09-001101

Datasheet

Bulk 510 Active PGA 68 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3518-10H

14-3518-10H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3786 QRF
- +

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14-3518-10H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
124-83-322-41-002101

124-83-322-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3538 QRF
- +

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Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-064-10-001101

510-83-064-10-001101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

2333 QRF
- +

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510-83-064-10-001101

Datasheet

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED