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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-0518-11

20-0518-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2706 QRF
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20-0518-11

Datasheet

Bulk 518 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-11

20-1518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3146 QRF
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20-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-650-41-005101

110-83-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3613 QRF
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110-83-650-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-314-T-A1

APA-314-T-A1

ADAPTER PLUG

Samtec Inc.

2628 QRF
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Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
124-83-422-41-002101

124-83-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2300 QRF
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Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-108-12-051101

510-87-108-12-051101

CONN SOCKET PGA 108POS GOLD

Preci-Dip

3615 QRF
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510-87-108-12-051101

Datasheet

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-6513-10

16-6513-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3176 QRF
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16-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0513-11

13-0513-11

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3033 QRF
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13-0513-11

Datasheet

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10T

27-0518-10T

CONN SOCKET SIP 27POS GOLD

Aries Electronics

3640 QRF
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27-0518-10T

Datasheet

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-320-11-001101

299-87-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3100 QRF
- +

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299-87-320-11-001101

Datasheet

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-44-032-17-400004

540-44-032-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

2579 QRF
- +

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540-44-032-17-400004

Datasheet

Tape & Reel (TR) 540 Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
299-87-614-10-002101

299-87-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3596 QRF
- +

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299-87-614-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-006101

116-87-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2241 QRF
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116-87-652-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
25-0513-10T

25-0513-10T

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2418 QRF
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25-0513-10T

Datasheet

Bulk 0513 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-109-12-051101

510-87-109-12-051101

CONN SOCKET PGA 109POS GOLD

Preci-Dip

3367 QRF
- +

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510-87-109-12-051101

Datasheet

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-648-41-117101

114-83-648-41-117101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3579 QRF
- +

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114-83-648-41-117101

Datasheet

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-018101

116-83-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3797 QRF
- +

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116-83-636-41-018101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-011101

116-83-324-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2249 QRF
- +

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116-83-324-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-432-41-035101

146-83-432-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3853 QRF
- +

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146-83-432-41-035101

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-432-41-036101

146-83-432-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2517 QRF
- +

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146-83-432-41-036101

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED