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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-632-41-007101

116-87-632-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2440 QRF
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116-87-632-41-007101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-964-41-001101

115-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2576 QRF
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Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
07-0508-30

07-0508-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3561 QRF
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07-0508-30

Datasheet

Bulk 508 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
ICA-316-SST

ICA-316-SST

.100 SCREW MACHINE DIP SOCKET

Samtec Inc.

2078 QRF
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Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
ICO-318-MTT

ICO-318-MTT

100 LOW PROFILE SCREW MACHINE D

Samtec Inc.

3704 QRF
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Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-87-648-41-018101

116-87-648-41-018101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2289 QRF
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116-87-648-41-018101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-3513-10T

22-3513-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2331 QRF
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22-3513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-10E

08-3518-10E

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2791 QRF
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08-3518-10E

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-11H

08-3518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2959 QRF
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08-3518-11H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-632-41-801101

110-83-632-41-801101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2424 QRF
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110-83-632-41-801101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-632-41-001101

121-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3241 QRF
- +

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121-83-632-41-001101

Datasheet

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-107-12-051101

510-87-107-12-051101

CONN SOCKET PGA 107POS GOLD

Preci-Dip

2934 QRF
- +

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510-87-107-12-051101

Datasheet

Bulk 510 Active PGA 107 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-105161

110-83-640-41-105161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2946 QRF
- +

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110-83-640-41-105161

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-012101

116-87-640-41-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3929 QRF
- +

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116-87-640-41-012101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-324-41-002101

124-83-324-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2807 QRF
- +

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Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
8114LB603G

8114LB603G

HEATSINK

Aavid, Thermal Division of Boyd Corporation

2246 QRF
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- - Active - - - - - - - - - - - - - -
4-1571552-9

4-1571552-9

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

3362 QRF
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4-1571552-9

Datasheet

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-328-41-009101

116-83-328-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2810 QRF
- +

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116-83-328-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-6513-10T

18-6513-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3312 QRF
- +

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18-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0513-10H

18-0513-10H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2128 QRF
- +

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18-0513-10H

Datasheet

Bulk 0513 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED