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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
36-6554-16

36-6554-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3854 QRF
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36-6554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
514-83-576M30-001148

514-83-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

3323 QRF
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514-83-576M30-001148

Datasheet

Bulk 514 Active BGA 576 (30 x 30) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-3518-11H

24-3518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3053 QRF
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24-3518-11H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109042

1109042

537 ZIF TEST SCKT LIVE BUG TYPE

Aries Electronics

3298 QRF
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1109042

Datasheet

- - Active - - - - - - - - - - - - - -
1109043

1109043

538 ZIF TEST SCKT LIVE BUG TYPE

Aries Electronics

3330 QRF
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1109043

Datasheet

- - Active - - - - - - - - - - - - - -
518-77-500M30-001106

518-77-500M30-001106

CONN SOCKET PGA 500POS GOLD

Preci-Dip

2755 QRF
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518-77-500M30-001106

Datasheet

Bulk 518 Active PGA 500 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
44-6556-41

44-6556-41

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

3785 QRF
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44-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
550-10-576M30-001152

550-10-576M30-001152

BGA SOLDER TAIL

Preci-Dip

2660 QRF
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550-10-576M30-001152

Datasheet

Bulk 550 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-504M29-001106

518-77-504M29-001106

CONN SOCKET PGA 504POS GOLD

Preci-Dip

3945 QRF
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518-77-504M29-001106

Datasheet

Bulk 518 Active PGA 504 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-13-299-20-096003

510-13-299-20-096003

PIN GRID ARRAY SOCKETS

Mill-Max Manufacturing Corp.

3743 QRF
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Tube 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-299-20-096001

510-13-299-20-096001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2882 QRF
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510-13-299-20-096001

Datasheet

Bulk 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-299-20-096002

510-13-299-20-096002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3181 QRF
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510-13-299-20-096002

Datasheet

Bulk 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-520M31-001104

558-10-520M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3260 QRF
- +

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558-10-520M31-001104

Datasheet

Bulk 558 Active BGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-520M31-001105

518-77-520M31-001105

CONN SOCKET PGA 520POS GOLD

Preci-Dip

2758 QRF
- +

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518-77-520M31-001105

Datasheet

Bulk 518 Active PGA 520 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
209-PGM17020-10H

209-PGM17020-10H

CONN SOCKET PGA GOLD

Aries Electronics

2009 QRF
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209-PGM17020-10H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-560M33-001101

558-10-560M33-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3771 QRF
- +

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558-10-560M33-001101

Datasheet

Bulk 558 Active PGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
48-6556-41

48-6556-41

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2827 QRF
- +

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48-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
514-83-600M35-001148

514-83-600M35-001148

CONN SOCKET BGA 600POS GOLD

Preci-Dip

2823 QRF
- +

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514-83-600M35-001148

Datasheet

Bulk 514 Active BGA 600 (35 x 35) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-520M31-001106

518-77-520M31-001106

CONN SOCKET PGA 520POS GOLD

Preci-Dip

3632 QRF
- +

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518-77-520M31-001106

Datasheet

Bulk 518 Active PGA 520 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
40-6554-16

40-6554-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3692 QRF
- +

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40-6554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED