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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6575-16

48-6575-16

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3175 QRF
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48-6575-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6556-40

44-6556-40

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2004 QRF
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44-6556-40

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
40-6556-41

40-6556-41

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2497 QRF
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40-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
558-10-500M30-001101

558-10-500M30-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2473 QRF
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558-10-500M30-001101

Datasheet

Bulk 558 Active PGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-504M29-001101

558-10-504M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2874 QRF
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558-10-504M29-001101

Datasheet

Bulk 558 Active PGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-478M26-131104

558-10-478M26-131104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2948 QRF
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558-10-478M26-131104

Datasheet

Bulk 558 Active BGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-478M26-131105

518-77-478M26-131105

CONN SOCKET PGA 478POS GOLD

Preci-Dip

2122 QRF
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518-77-478M26-131105

Datasheet

Bulk 518 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-480M29-001104

558-10-480M29-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3762 QRF
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558-10-480M29-001104

Datasheet

Bulk 558 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-480M29-001105

518-77-480M29-001105

CONN SOCKET PGA 480POS GOLD

Preci-Dip

2447 QRF
- +

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518-77-480M29-001105

Datasheet

Bulk 518 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
48-6556-40

48-6556-40

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2949 QRF
- +

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48-6556-40

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
510-13-273-21-125001

510-13-273-21-125001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3405 QRF
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510-13-273-21-125001

Datasheet

Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-273-21-125002

510-13-273-21-125002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2177 QRF
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510-13-273-21-125002

Datasheet

Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-273-21-125003

510-13-273-21-125003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2670 QRF
- +

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510-13-273-21-125003

Datasheet

Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
192-PGM17043-10H

192-PGM17043-10H

CONN SOCKET PGA GOLD

Aries Electronics

2817 QRF
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192-PGM17043-10H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
42-6556-41

42-6556-41

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2077 QRF
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42-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
518-77-478M26-131106

518-77-478M26-131106

CONN SOCKET PGA 478POS GOLD

Preci-Dip

3932 QRF
- +

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518-77-478M26-131106

Datasheet

Bulk 518 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-520M31-001101

558-10-520M31-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3430 QRF
- +

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558-10-520M31-001101

Datasheet

Bulk 558 Active PGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-480M29-001106

518-77-480M29-001106

CONN SOCKET PGA 480POS GOLD

Preci-Dip

3353 QRF
- +

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518-77-480M29-001106

Datasheet

Bulk 518 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
100-PRS10001-12

100-PRS10001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2475 QRF
- +

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100-PRS10001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
514-83-560M33-001148

514-83-560M33-001148

CONN SOCKET BGA 560POS GOLD

Preci-Dip

2318 QRF
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514-83-560M33-001148

Datasheet

Bulk 514 Active BGA 560 (33 x 33) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED