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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-281-19-081003

510-13-281-19-081003

CONN RECEPT PIN

Mill-Max Manufacturing Corp.

2166 QRF
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Tube 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-281-19-081001

510-13-281-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3874 QRF
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510-13-281-19-081001

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-281-19-081002

510-13-281-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2872 QRF
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510-13-281-19-081002

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-560M33-001152

550-10-560M33-001152

BGA SOLDER TAIL

Preci-Dip

2737 QRF
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550-10-560M33-001152

Datasheet

Bulk 550 Active BGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-500M30-001104

558-10-500M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3072 QRF
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558-10-500M30-001104

Datasheet

Bulk 558 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-500M30-001105

518-77-500M30-001105

CONN SOCKET PGA 500POS GOLD

Preci-Dip

3147 QRF
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518-77-500M30-001105

Datasheet

Bulk 518 Active PGA 500 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-504M29-001104

558-10-504M29-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2520 QRF
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558-10-504M29-001104

Datasheet

Bulk 558 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-289-17-000001

510-13-289-17-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3157 QRF
- +

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510-13-289-17-000001

Datasheet

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-289-17-000002

510-13-289-17-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2225 QRF
- +

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510-13-289-17-000002

Datasheet

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-289-17-000003

510-13-289-17-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3657 QRF
- +

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510-13-289-17-000003

Datasheet

Bulk 510 Active PGA 289 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-504M29-001105

518-77-504M29-001105

CONN SOCKET PGA 504POS GOLD

Preci-Dip

3608 QRF
- +

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518-77-504M29-001105

Datasheet

Bulk 518 Active PGA 504 (29 x 29) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
20-PLS13120-12

20-PLS13120-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3069 QRF
- +

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20-PLS13120-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
20-PRS13120-12

20-PRS13120-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2522 QRF
- +

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20-PRS13120-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
36-3551-16

36-3551-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3401 QRF
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36-3551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3553-16

36-3553-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3439 QRF
- +

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36-3553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6551-16

36-6551-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2993 QRF
- +

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36-6551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6552-16

36-6552-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2648 QRF
- +

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36-6552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6553-16

36-6553-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

2259 QRF
- +

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36-6553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3552-16

36-3552-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3352 QRF
- +

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36-3552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3554-16

36-3554-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3982 QRF
- +

  Add To Cart

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36-3554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED