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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
42-3572-10

42-3572-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3346 QRF
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42-3572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3573-10

42-3573-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2565 QRF
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42-3573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3574-10

42-3574-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2784 QRF
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42-3574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3575-10

42-3575-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2229 QRF
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42-3575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6570-10

42-6570-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2791 QRF
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42-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
30-0508-21

30-0508-21

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3266 QRF
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30-0508-21

Datasheet

Bulk 508 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
30-0508-31

30-0508-31

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3961 QRF
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30-0508-31

Datasheet

Bulk 508 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
123-93-952-41-001000

123-93-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2003 QRF
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123-93-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-952-41-001000

123-43-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2135 QRF
- +

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123-43-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-101002

510-91-168-17-101002

SOCKET SOLDERTAIL 168-PGA

Mill-Max Manufacturing Corp.

2665 QRF
- +

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Tube 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-168-17-101002

510-41-168-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2920 QRF
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510-41-168-17-101002

Datasheet

Tube 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-428-61-003000

115-43-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2604 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-428-61-003000

115-93-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2260 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
110-43-422-61-605000

110-43-422-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3488 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
110-93-422-61-605000

110-93-422-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2659 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
30-1508-21

30-1508-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2833 QRF
- +

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30-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
30-1508-31

30-1508-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2188 QRF
- +

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30-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
48-6823-90T

48-6823-90T

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

2440 QRF
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48-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
1554653-1

1554653-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

3637 QRF
- +

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1554653-1

Datasheet

Tray - Last Time Buy LGA 2011 (47 x 58) - Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder - Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
126-93-648-41-003000

126-93-648-41-003000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

2863 QRF
- +

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126-93-648-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED