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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6501-21

48-6501-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3293 QRF
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48-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6501-31

48-6501-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3951 QRF
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48-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-650-41-001000

612-13-650-41-001000

SOCKET CARRIER SLDRTL .600 50POS

Mill-Max Manufacturing Corp.

3874 QRF
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612-13-650-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-432-61-001000

115-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3517 QRF
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Tube * Active - - - - - - - - - - - - - -
115-43-632-61-001000

115-43-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3965 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-432-61-001000

115-93-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3274 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-632-61-001000

115-93-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2472 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

2541 QRF
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517-83-364-17-091111

Datasheet

Bulk 517 Active PGA 364 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-43-316-61-008000

116-43-316-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3287 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
116-93-316-61-008000

116-93-316-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2812 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
110-44-950-61-001000

110-44-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2201 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
110-99-950-61-001000

110-99-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2568 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
APA-324-G-B

APA-324-G-B

ADAPTER PLUG

Samtec Inc.

2238 QRF
- +

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Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-G-B

APA-624-G-B

ADAPTER PLUG

Samtec Inc.

3486 QRF
- +

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Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-43-314-61-001000

116-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2714 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
116-93-314-61-001000

116-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3112 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
510-93-128-13-041001

510-93-128-13-041001

SOCKET SOLDERTAIL 128-PGA

Mill-Max Manufacturing Corp.

3419 QRF
- +

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Tube 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-128-13-041001

510-43-128-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3758 QRF
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510-43-128-13-041001

Datasheet

Tube 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-3570-10

42-3570-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2532 QRF
- +

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42-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3571-10

42-3571-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3389 QRF
- +

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42-3571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED