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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
34-6621-30

34-6621-30

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

3505 QRF
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34-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
69-PGM11030-11

69-PGM11030-11

CONN SOCKET PGA GOLD

Aries Electronics

3746 QRF
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69-PGM11030-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
69-PGM11031-11

69-PGM11031-11

CONN SOCKET PGA GOLD

Aries Electronics

2215 QRF
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69-PGM11031-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
69-PGM11053-11

69-PGM11053-11

CONN SOCKET PGA GOLD

Aries Electronics

3838 QRF
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69-PGM11053-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-316-61-007000

116-43-316-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2545 QRF
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116-93-316-61-007000

116-93-316-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3211 QRF
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127-93-664-41-002000

127-93-664-41-002000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2421 QRF
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127-93-664-41-002000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-664-41-002000

127-43-664-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2473 QRF
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127-43-664-41-002000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-632-41-801000

123-13-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3101 QRF
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123-13-632-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-328-61-001000

111-43-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2084 QRF
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111-43-428-61-001000

111-43-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3120 QRF
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111-43-628-61-001000

111-43-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3347 QRF
- +

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111-93-328-61-001000

111-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3375 QRF
- +

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111-93-428-61-001000

111-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2835 QRF
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111-93-628-61-001000

111-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2048 QRF
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126-93-952-41-002000

126-93-952-41-002000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3734 QRF
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126-93-952-41-002000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-952-41-002000

126-43-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2526 QRF
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126-43-952-41-002000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-632-41-801000

122-13-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3430 QRF
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122-13-632-41-801000

Datasheet

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-272M20-001166

550-10-272M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3570 QRF
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550-10-272M20-001166

Datasheet

Bulk 550 Active BGA 272 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
110-41-652-61-001000

110-41-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3560 QRF
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  • EA-CHIP INDUSTRY CO., LIMITED