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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6575-11

24-6575-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3312 QRF
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24-6575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
26-3503-21

26-3503-21

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2714 QRF
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26-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-3503-31

26-3503-31

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3634 QRF
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26-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
115-43-420-61-003000

115-43-420-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2026 QRF
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115-93-420-61-003000

115-93-420-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3228 QRF
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110-91-640-61-001000

110-91-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2063 QRF
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110-43-316-61-105000

110-43-316-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2631 QRF
- +

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110-93-316-61-105000

110-93-316-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2964 QRF
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36-6556-11

36-6556-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2928 QRF
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36-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
18-3508-21

18-3508-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3749 QRF
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18-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-31

18-3508-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3960 QRF
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18-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-43-322-61-001000

111-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2552 QRF
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111-43-422-61-001000

111-43-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2880 QRF
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111-93-322-61-001000

111-93-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2745 QRF
- +

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111-93-422-61-001000

111-93-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3083 QRF
- +

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121-11-950-41-001000

121-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3180 QRF
- +

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121-11-950-41-001000

Datasheet

Tube 121 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-324-61-001000

115-43-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2653 QRF
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115-43-424-61-001000

115-43-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3723 QRF
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115-43-624-61-001000

115-43-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2656 QRF
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115-93-324-61-001000

115-93-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2110 QRF
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  • EA-CHIP INDUSTRY CO., LIMITED