Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-41-648-41-003000

126-41-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3886 QRF
- +

  Add To Cart

  Inquiry Now

126-41-648-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-648-41-003000

126-91-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3396 QRF
- +

  Add To Cart

  Inquiry Now

126-91-648-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-0501-21

28-0501-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3321 QRF
- +

  Add To Cart

  Inquiry Now

28-0501-21

Datasheet

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-31

28-0501-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2416 QRF
- +

  Add To Cart

  Inquiry Now

28-0501-31

Datasheet

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics

2119 QRF
- +

  Add To Cart

  Inquiry Now

37-0501-20

Datasheet

Bulk 501 Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-30

37-0501-30

CONN SOCKET SIP 37POS TIN

Aries Electronics

3346 QRF
- +

  Add To Cart

  Inquiry Now

37-0501-30

Datasheet

Bulk 501 Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-21

16-3508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2374 QRF
- +

  Add To Cart

  Inquiry Now

16-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-31

16-3508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3830 QRF
- +

  Add To Cart

  Inquiry Now

16-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-650-41-004000

612-43-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2027 QRF
- +

  Add To Cart

  Inquiry Now

612-43-650-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-650-41-004000

612-93-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2647 QRF
- +

  Add To Cart

  Inquiry Now

612-93-650-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0508-21

25-0508-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3155 QRF
- +

  Add To Cart

  Inquiry Now

25-0508-21

Datasheet

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
25-0508-31

25-0508-31

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3832 QRF
- +

  Add To Cart

  Inquiry Now

25-0508-31

Datasheet

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-6820-90C

40-6820-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3695 QRF
- +

  Add To Cart

  Inquiry Now

40-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6822-90C

40-6822-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2979 QRF
- +

  Add To Cart

  Inquiry Now

40-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6823-90C

40-6823-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3812 QRF
- +

  Add To Cart

  Inquiry Now

40-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-44-424-61-003000

115-44-424-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2124 QRF
- +

  Add To Cart

  Inquiry Now

Tube * Active - - - - - - - - - - - - - -
612-11-950-41-001000

612-11-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3182 QRF
- +

  Add To Cart

  Inquiry Now

612-11-950-41-001000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-6554-10

42-6554-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3540 QRF
- +

  Add To Cart

  Inquiry Now

42-6554-10

Datasheet

Tray 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3551-10

42-3551-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2152 QRF
- +

  Add To Cart

  Inquiry Now

42-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3552-10

42-3552-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2140 QRF
- +

  Add To Cart

  Inquiry Now

42-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 569570571572573574575576...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • EA-CHIP INDUSTRY CO., LIMITED