Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
116-43-314-61-006000CONN IC SKT DBL |
3450 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-314-61-006000CONN IC SKT DBL |
2762 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
30-81250-610CCONN IC DIP SOCKET 30POS GOLD |
3460 | QRF |
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Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
30-8563-610CCONN IC DIP SOCKET 30POS GOLD |
3013 | QRF |
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Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
30-8940-310CCONN IC DIP SOCKET 30POS GOLD |
2687 | QRF |
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Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
30-8950-610CCONN IC DIP SOCKET 30POS GOLD |
2397 | QRF |
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Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
605-93-964-11-480000SOCKET CARRIER LOWPRO .900 64POS |
3923 | QRF |
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Datasheet |
Tube | 605 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
605-43-964-11-480000SKT CARRIER LOWPRO |
2424 | QRF |
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Datasheet |
Tube | 605 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
116-47-950-41-001000STANDRD SOLDRTL |
2349 | QRF |
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Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
124-41-652-41-002000CONN IC SKT DBL |
2475 | QRF |
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Datasheet |
Tube | 124 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
124-41-952-41-002000CONN IC SKT DBL |
3328 | QRF |
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Datasheet |
Tube | 124 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
124-91-652-41-002000CONN IC SKT DBL |
3216 | QRF |
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Datasheet |
Tube | 124 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
124-91-952-41-002000CONN IC SKT DBL |
2095 | QRF |
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Datasheet |
Tube | 124 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
25-0511-11CONN SOCKET SIP 25POS GOLD |
2828 | QRF |
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Datasheet |
Bulk | 511 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
24-0511-11CONN SOCKET SIP 24POS GOLD |
3856 | QRF |
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Datasheet |
Bulk | 511 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
110-44-648-61-001000CONN IC SKT DBL |
2794 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-99-648-61-001000CONN IC SKT DBL |
2404 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
115-43-324-61-003000CONN IC SKT DBL |
3637 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
115-43-624-61-003000CONN IC SKT DBL |
2975 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
115-93-324-61-003000CONN IC SKT DBL |
3962 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
Tel