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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-314-61-006000

116-43-314-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3450 QRF
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116-93-314-61-006000

116-93-314-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2762 QRF
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30-81250-610C

30-81250-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3460 QRF
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30-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8563-610C

30-8563-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3013 QRF
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30-8563-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8940-310C

30-8940-310C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2687 QRF
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30-8940-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8950-610C

30-8950-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2397 QRF
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30-8950-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
605-93-964-11-480000

605-93-964-11-480000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp.

3923 QRF
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605-93-964-11-480000

Datasheet

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-964-11-480000

605-43-964-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2424 QRF
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605-43-964-11-480000

Datasheet

Tube 605 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-950-41-001000

116-47-950-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2349 QRF
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116-47-950-41-001000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-652-41-002000

124-41-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2475 QRF
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124-41-652-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-952-41-002000

124-41-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3328 QRF
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124-41-952-41-002000

Datasheet

Tube 124 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-652-41-002000

124-91-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3216 QRF
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124-91-652-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-952-41-002000

124-91-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2095 QRF
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124-91-952-41-002000

Datasheet

Tube 124 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2828 QRF
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25-0511-11

Datasheet

Bulk 511 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0511-11

24-0511-11

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3856 QRF
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24-0511-11

Datasheet

Bulk 511 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-44-648-61-001000

110-44-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2794 QRF
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110-99-648-61-001000

110-99-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2404 QRF
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115-43-324-61-003000

115-43-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3637 QRF
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115-43-624-61-003000

115-43-624-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2975 QRF
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115-93-324-61-003000

115-93-324-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3962 QRF
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  • EA-CHIP INDUSTRY CO., LIMITED