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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
64-9518-11H

64-9518-11H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

2730 QRF
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64-9518-11H

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-41-964-41-008000

116-41-964-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2101 QRF
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116-41-964-41-008000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-964-41-008000

116-91-964-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2313 QRF
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116-91-964-41-008000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-210-61-001000

116-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3264 QRF
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116-93-210-61-001000

116-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3379 QRF
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550-10-149-15-063101

550-10-149-15-063101

PGA SOLDER TAIL

Preci-Dip

3105 QRF
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550-10-149-15-063101

Datasheet

Bulk 550 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-13-642-41-001000

123-13-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

3388 QRF
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123-13-642-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-424-61-001000

110-43-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3623 QRF
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110-93-424-61-001000

110-93-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3952 QRF
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40-6508-302

40-6508-302

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2891 QRF
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40-6508-302

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-43-322-61-003000

115-43-322-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2600 QRF
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115-93-322-61-003000

115-93-322-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2326 QRF
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612-11-650-41-001000

612-11-650-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3832 QRF
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612-11-650-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-068-11-061001

510-13-068-11-061001

SOCKET SOLDERTAIL 68-PGA

Mill-Max Manufacturing Corp.

2181 QRF
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Tube 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-952-41-001000

123-91-952-41-001000

SOCKET IC OPEN 3 LVL .900 52POS

Mill-Max Manufacturing Corp.

3408 QRF
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Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-952-41-001000

123-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2498 QRF
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123-41-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-022-05-001001

510-93-022-05-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2265 QRF
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510-93-022-05-001001

Datasheet

Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-022-05-001002

510-93-022-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3829 QRF
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510-93-022-05-001002

Datasheet

Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-022-05-001003

510-93-022-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2354 QRF
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510-93-022-05-001003

Datasheet

Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-320-61-605000

110-43-320-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2280 QRF
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  • EA-CHIP INDUSTRY CO., LIMITED