Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
64-9518-11HCONN IC DIP SOCKET 64POS GOLD |
2730 | QRF |
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Datasheet |
Bulk | 518 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
116-41-964-41-008000CONN IC SKT DBL |
2101 | QRF |
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Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
116-91-964-41-008000CONN IC SKT DBL |
2313 | QRF |
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Datasheet |
Tube | 116 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
116-43-210-61-001000CONN IC SKT DBL |
3264 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-210-61-001000CONN IC SKT DBL |
3379 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
550-10-149-15-063101PGA SOLDER TAIL |
3105 | QRF |
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Datasheet |
Bulk | 550 | Active | PGA | 149 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
123-13-642-41-001000CONN IC DIP SOCKET 42POS GOLD |
3388 | QRF |
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Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
110-43-424-61-001000CONN IC SKT DBL |
3623 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-93-424-61-001000CONN IC SKT DBL |
3952 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
40-6508-302CONN IC DIP SOCKET 40POS GOLD |
2891 | QRF |
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Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
115-43-322-61-003000CONN IC SKT DBL |
2600 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
115-93-322-61-003000CONN IC SKT DBL |
2326 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
612-11-650-41-001000SKT CARRIER SOLDRTL |
3832 | QRF |
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Datasheet |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-13-068-11-061001SOCKET SOLDERTAIL 68-PGA |
2181 | QRF |
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Tube | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
123-91-952-41-001000SOCKET IC OPEN 3 LVL .900 52POS |
3408 | QRF |
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Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
123-41-952-41-001000CONN IC SKT DBL |
2498 | QRF |
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Datasheet |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-93-022-05-001001SKT PGA SOLDRTL |
2265 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-93-022-05-001002SKT PGA SOLDRTL |
3829 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-93-022-05-001003SKT PGA SOLDRTL |
2354 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
110-43-320-61-605000CONN IC SKT DBL |
2280 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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