Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
123-43-422-41-001000CONN IC DIP SOCKET 22POS GOLD |
169 | 19.22 |
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Datasheet |
Tube | 123 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
8058-1G49CONN TRANSIST TO-5 8POS GOLD |
130 | 19.29 |
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Datasheet |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | |
299-93-306-10-001000CONN IC DIP SOCKET 6POS GOLD |
547 | 19.49 |
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Datasheet |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
123-43-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
248 | 19.69 |
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Datasheet |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
123-43-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
300 | 19.81 |
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Datasheet |
Tube | 123 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
612-11-420-41-001000SKT CARRIER SOLDRTL |
226 | 19.85 |
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Datasheet |
Tube | 612 | Active | DIP, 0.1 (2.54mm) Row Spacing | - | 0.039 (1.00mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.039 (1.00mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
210-13-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
1129 | 20.51 |
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Datasheet |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
299-93-324-11-001000CONN IC DIP SOCKET 24POS GOLD |
157 | 21.27 |
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Datasheet |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
299-43-324-11-001000CONN IC DIP SOCKET 24POS GOLD |
112 | 21.27 |
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Datasheet |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
299-93-622-10-002000CONN IC DIP SOCKET 22POS GOLD |
195 | 22.78 |
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Datasheet |
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
1051420132CONN SOCKET LGA 2011POS GOLD |
211 | 23.80 |
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Datasheet |
Bulk | 105142 | Obsolete | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | - | - | - | Thermoplastic | |
123-43-950-41-001000CONN IC DIP SOCKET 50POS GOLD |
179 | 26.82 |
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Datasheet |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
123-43-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
145 | 27.41 |
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Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
2174988-2CONN SOCKET LGA 2011POS GOLD |
163 | 29.16 |
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Datasheet |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | |
299-93-636-10-002000CONN IC DIP SOCKET 36POS GOLD |
183 | 30.15 |
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Datasheet |
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
200-6313-9UN-1900CONN SOCKET PGA ZIF 169POS GOLD |
119 | 58.50 |
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Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | |
200-6315-9UN-1900CONN SOCKET PGA ZIF 225POS GOLD |
3413 | 91.84 |
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Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100 (2.54mm) | - | - | - | - | - | - | 0.100 (2.54mm) | - | - | - | Polyethersulfone (PES) | |
200-6319-9UN-1900CONN SOCKET PGA ZIF 361POS GOLD |
125 | 99.54 |
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Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | |
200-6321-9UN-1900CONN SOCKET PGA ZIF 441POS GOLD |
3519 | 122.25 |
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Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 441 (21 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | |
105167-00016.50 BY 6.50MM CAMERA SOCKET, 4. |
330300 | 0.63 |
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Datasheet |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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