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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
211-1-06-003

211-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

8006 0.71
- +

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211-1-06-003

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
211-1-08-003

211-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

5796 0.79
- +

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211-1-08-003

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
DILB24P-224TLF

DILB24P-224TLF

CONN IC DIP SOCKET 24POS TINLEAD

Amphenol ICC (FCI)

10853 0.85
- +

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DILB24P-224TLF

Datasheet

Tube DILB Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon
211-1-14-003

211-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

2554 0.97
- +

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211-1-14-003

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
D01-9970742

D01-9970742

CONN SOCKET SIP 7POS GOLD

Harwin Inc.

4797 0.98
- +

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D01-9970742

Datasheet

Tube D01-997 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9971242

D01-9971242

CONN SOCKET SIP 12POS GOLD

Harwin Inc.

4700 1.08
- +

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D01-9971242

Datasheet

Tube D01-997 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
211-1-16-003

211-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

2759 1.23
- +

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211-1-16-003

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
211-1-18-003

211-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

2790 1.36
- +

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211-1-18-003

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
ICA-308-STT

ICA-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

3040 1.50
- +

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ICA-308-STT

Datasheet

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
211-1-20-003

211-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

1281 1.53
- +

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211-1-20-003

Datasheet

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
1050281001

1050281001

CONN CAM SOCKET 32POS GOLD

Molex

21667 2.25
- +

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1050281001

Datasheet

Tape & Reel (TR),Cut Tape (CT),Digi-Reel® 105028 Active Camera Socket 32 (4 x 8) 0.035 (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
211-1-24-006

211-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

1307 1.66
- +

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211-1-24-006

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
211-1-28-006

211-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech

1315 1.83
- +

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211-1-28-006

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
NTE435K64

NTE435K64

SOCKET-64 PIN DIP .070

NTE Electronics, Inc

296 1.93
- +

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NTE435K64

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
ICA-318-STT

ICA-318-STT

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.

1054 2.59
- +

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ICA-318-STT

Datasheet

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
NTE419

NTE419

SOCKET-3-PIN TO-5

NTE Electronics, Inc

600 2.88
- +

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NTE419

Datasheet

Bulk - Active Transistor, TO-5 and TO-39 3 (Round) - - - - Through Hole - Solder - - - - -
NTE209

NTE209

SOCKET TO-3 PWR

NTE Electronics, Inc

267 3.28
- +

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NTE209

Datasheet

Bulk - Active Transistor, TO-3 2 (1 x 2) - - - - Through Hole - - - - - - -
NTE435K52

NTE435K52

SOCKET-52 PIN DIP .070

NTE Electronics, Inc

1116 3.43
- +

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NTE435K52

Datasheet

Bulk - Active DIP, 0.698 (17.72mm) Row Spacing 52 (2 x 26) - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
ICF-328-T-O-TR

ICF-328-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

350 3.45
- +

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Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
NTE436W28

NTE436W28

28-PIN DIP IC SOCKET

NTE Electronics, Inc

296 3.98
- +

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NTE436W28

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) - - - - Through Hole - Wire Wrap - - - - -
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  • EA-CHIP INDUSTRY CO., LIMITED