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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-43-624-41-801000

123-43-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

199 8.39
- +

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123-43-624-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8058-1G23

8058-1G23

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

1171 8.40
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8058-1G23

Datasheet

Bulk 8058 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
8060-1G3

8060-1G3

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

995 8.78
- +

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8060-1G3

Datasheet

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
8058-1G24

8058-1G24

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

749 9.32
- +

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8058-1G24

Datasheet

Bulk 8058 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Panel Mount - Solder Cup - Gold - Brass Polytetrafluoroethylene (PTFE)
2041549-1

2041549-1

SOCKET ASSY, DMD 350, T/R, G/F

TE Connectivity AMP Connectors

658 9.56
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Tape & Reel (TR),Cut Tape (CT) DMD Active PGA, ZIF (ZIP) 350 (35 x 36) 0.050 (1.27mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin-Lead - Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled
ICF-632-S-O-TR

ICF-632-S-O-TR

CONN IC DIP SOCKET 32POS TIN

Samtec Inc.

273 9.97
- +

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ICF-632-S-O-TR

Datasheet

Tape & Reel (TR),Cut Tape (CT),Digi-Reel® iCF Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
12-8473-310C

12-8473-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

170 10.22
- +

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12-8473-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-668-41-005000

117-43-668-41-005000

CONN IC DIP SOCKET 68POS GOLD

Mill-Max Manufacturing Corp.

198 10.26
- +

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117-43-668-41-005000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8060-1G12

8060-1G12

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

1104 11.73
- +

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8060-1G12

Datasheet

Bulk 8060 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP)
8060-1G11

8060-1G11

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

3869 12.58
- +

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8060-1G11

Datasheet

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

TE Connectivity AMP Connectors

451 13.94
- +

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2350616-1

Datasheet

Tray - Active LGA 250 (16 x 25) 0.039 (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic
299-43-632-10-002000

299-43-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

351 13.99
- +

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299-43-632-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8059-2G9

8059-2G9

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors

1052 15.40
- +

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8059-2G9

Datasheet

Bulk 8059 Obsolete Transistor, TO-5 10 (Round) - Gold - Copper Alloy Through Hole - Solder - Gold - Copper Alloy Polyamide (PA), Nylon, Glass Filled
116-93-308-41-007000

116-93-308-41-007000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1264 15.98
- +

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116-93-308-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-314-41-105000

110-43-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

110 16.07
- +

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110-43-314-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-310-41-105000

110-93-310-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2270 16.24
- +

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110-93-310-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
101-93-422-41-560000

101-93-422-41-560000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

486 16.61
- +

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101-93-422-41-560000

Datasheet

Tube 101 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-318-41-007000

116-93-318-41-007000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

892 18.23
- +

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116-93-318-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8060-1G5

8060-1G5

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

184 18.29
- +

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8060-1G5

Datasheet

Bulk 8060 Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
123-93-320-41-801000

123-93-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

150 19.04
- +

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123-93-320-41-801000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED