Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DHS-B9090-44AHEATSINK ASSY INTEL LGA1366 |
3208 | QRF |
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Datasheet |
Box | - | Active | Board Level | Bolt On | Square | 3.543 (90.00mm) | 3.543 (90.00mm) | - | 1.004 (25.50mm) | - | - | 0.27°C/W | Aluminum | ||
HS-XU3-SET-R2ACC HEATSINK MA-XU3 |
2318 | QRF |
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Box | Mars XU3 | Active | - | - | - | - | - | - | - | - | - | - | - | |||
DHS-B10878-12HEATSINK |
3966 | QRF |
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Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | |||
40432BOM HEATSINK PUSH PIN LF 4623 |
2878 | QRF |
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Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | |||
40531HEATSINK 19MM W/ GROUNDING TAB |
2491 | QRF |
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Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | |||
1253621.45WX36 EXTRUSION 14363 |
2889 | QRF |
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Datasheet |
Box | - | Active | Top Mount, Extrusion | Adhesive | Rectangular, Fins | 36.000 (914.40mm) | 1.450 (36.83mm) | - | 0.768 (19.50mm) | - | - | 1.05°C/W | Aluminum | ||
433KHEATSINK FOR PWR SEMI |
3821 | QRF |
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Datasheet |
Bulk | 433 | Active | Board Level, Extrusion | Press Fit | Rectangular, Fins | 5.000 (127.00mm) | 4.750 (120.65mm) | - | 3.000 (76.20mm) | 50.0W @ 42°C | 0.28°C/W @ 250 LFM | - | Aluminum | ||
SKV808012-CUCOPPER HEATSINK 80X80X12MM |
3633 | QRF |
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Datasheet |
Bulk | SKV | Active | Top Mount, Skived | Push Pin | Square, Fins | 3.150 (80.00mm) | 3.150 (80.00mm) | - | 0.472 (12.00mm) | - | 1.20°C/W @ 200 LFM | 5.10°C/W | Copper | ||
40483BOM ASSY 4623 LF PUSH PIN HTSN |
2702 | QRF |
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Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | |||
8-1542002-240MM HS ASSY ULTEM CL |
500 | QRF |
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Datasheet |
Tray,Tray | - | Active | Top Mount | Clip | Cylindrical | - | - | 1.375 (34.92mm) OD | 0.491 (12.47mm) | - | 4.70°C/W @ 200 LFM | 9.39°C/W | Aluminum | ||
647058INTEL XEON CPU COOLER 1U |
2613 | QRF |
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Tray | - | Active | Top Mount | Bolt On | Rectangular, Fins | 4.252 (108.00mm) | 3.071 (78.00mm) | - | 0.992 (25.20mm) | - | - | - | - | |||
302NNHEATSINK COMPACT |
2955 | QRF |
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Datasheet |
Bulk | 302 | Active | Board Level, Vertical | Press Fit | Rectangular, Fins | 2.000 (50.80mm) | 1.500 (38.10mm) | - | 2.000 (50.80mm) | 15.0W @ 50°C | 1.80°C/W @ 250 LFM | - | Aluminum Alloy | ||
40139BOM, ASSEMBLY, 3623 XF PUSH PI |
2938 | QRF |
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Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | |||
40704BOM ASSEMBLY HEATSINK TOP 2361 |
3825 | QRF |
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Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | |||
303NHEATSINK COMPACT |
2310 | QRF |
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Datasheet |
Bulk | 303 | Active | Board Level, Vertical | Press Fit | Rectangular, Fins | 2.000 (50.80mm) | 3.000 (76.20mm) | - | 2.000 (50.80mm) | 15.0W @ 37°C | 1.30°C/W @ 250 LFM | - | Aluminum Alloy | ||
2207/PR11B ASSYHEAT SINK |
2074 | QRF |
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Datasheet |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | ||
DHS-B9292-05AHEATSINK ASSY INTEL LGA2011 |
3442 | QRF |
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Datasheet |
Box | - | Active | Board Level | Bolt On | Square, Fins | 3.602 (91.50mm) | 3.602 (91.50mm) | - | 2.519 (64.00mm) | - | - | 0.17°C/W | Aluminum | ||
441KHEATSINK HIGH PWR RECT/DIODES |
2986 | QRF |
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Datasheet |
Bulk | 441 | Active | Board Level, Extrusion | Press Fit | Rectangular, Fins | 5.500 (139.70mm) | 4.500 (114.30mm) | - | 4.500 (114.30mm) | 50.0W @ 34°C | 0.30°C/W @ 250 LFM | - | Aluminum | ||
DHS-B10878-48HEATSINK |
2604 | QRF |
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Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | |||
1-1542002-1HEAT SINK BGA 37.5MM 2FIN RADIAL |
3355 | QRF |
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Datasheet |
Box | - | Obsolete | - | Clip | Cylindrical | - | - | 1.375 (34.92mm) OD | 0.357 (9.07mm) | - | 6.30°C/W @ 200 LFM | 12.00°C/W | Aluminum |