Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
658-35ABT1EHEATSINK CPU 28MM SQBLK W/O TAPE |
2084 | QRF |
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Datasheet |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.250 (6.35mm) | - | 3.00°C/W @ 800 LFM | - | Aluminum | ||
HSE-B18508-060H-WHEAT SINK, EXTRUSION,TO-218, 50. |
3337 | QRF |
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Datasheet |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 2.000 (50.80mm) | 1.638 (41.60mm) | - | 0.984 (25.00mm) | 12.8W @ 75°C | 2.98°C/W @ 200 LFM | 5.86°C/W | Aluminum Alloy | ||
657-25ABPEHEATSINK TO-220 W/PINS BLK 2.5 |
2432 | QRF |
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Datasheet |
Bulk | 657 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.000 (25.40mm) | 1.650 (41.91mm) | - | 2.500 (63.50mm) | 6.0W @ 25°C | 2.70°C/W @ 200 LFM | - | Aluminum | ||
581002B02100GBOARD LEVEL HEAT SINK |
2148 | QRF |
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Datasheet |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.000 (25.40mm) | 0.640 (16.26mm) | - | 0.640 (16.26mm) | 4.0W @ 70°C | 4.00°C/W @ 500 LFM | 17.40°C/W | Aluminum | ||
658-35ABT5HEATSINK CPU 28MM SQ BLK W/TAPE |
3444 | QRF |
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Datasheet |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.350 (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Aluminum | ||
624-60ABT4EHEATSINK FOR 21MM BGA |
2777 | QRF |
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Datasheet |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.600 (15.24mm) | - | 1.00°C/W @ 400 LFM | - | Aluminum | ||
625-45ABT4EHEATSINK FOR 25MM BGA |
3551 | QRF |
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Datasheet |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.450 (11.43mm) | - | 8.00°C/W @ 400 LFM | - | Aluminum | ||
625-45ABT5HEATSINK FOR 25MM BGA |
3426 | QRF |
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Datasheet |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.450 (11.43mm) | - | 8.00°C/W @ 400 LFM | - | Aluminum | ||
HSE-B18318-0396HHEAT SINK, EXTRUSION,TO-218, 31. |
2477 | QRF |
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Datasheet |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.250 (31.75mm) | 1.654 (42.00mm) | - | 0.984 (25.00mm) | 9.1W @ 75°C | 2.57°C/W @ 200 LFM | 8.24°C/W | Aluminum Alloy | ||
625-35ABT5HEATSINK FOR 25MM BGA |
2108 | QRF |
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Datasheet |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.350 (8.89mm) | - | 1.00°C/W @ 400 LFM | - | Aluminum | ||
658-25ABT6HEATSINK CPU 28MM SQ BLK W/TAPE |
3108 | QRF |
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Datasheet |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.250 (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Aluminum | ||
655-26ABHEATSINK FOR 40MM BGA |
3214 | QRF |
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Datasheet |
Bulk | 655 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.600 (40.64mm) | 1.600 (40.64mm) | - | 0.260 (6.60mm) | 5.0W @ 60°C | 3.00°C/W @ 500 LFM | - | Aluminum | ||
6273BBOARD LEVEL HEAT SINK |
2748 | QRF |
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Datasheet |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.750 (19.05mm) | 0.750 (19.05mm) | - | 0.375 (9.52mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 21.00°C/W | Aluminum | ||
658-35ABT6HEATSINK CPU 28MM SQ BLK W/TAPE |
2098 | QRF |
ДобавитьРасследования |
Datasheet |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.350 (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Aluminum | ||
658-45ABT5HEATSINK CPU 28MM SQ BLK W/TAPE |
2244 | QRF |
ДобавитьРасследования |
Datasheet |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.450 (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Aluminum | ||
660-29ABT5HEATSINK EXTRUSION 37MM |
2927 | QRF |
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Datasheet |
Bulk | 660 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.530 (38.86mm) | 1.530 (38.86mm) | - | 0.285 (7.24mm) | 2.0W @ 30°C | 7.00°C/W @ 100 LFM | - | Aluminum | ||
311505A00000GBOARD LEVEL HEAT SINK |
3901 | QRF |
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Datasheet |
Bulk | - | Active | Board Level | Press Fit | Cylindrical | - | - | 0.317 (8.05mm) ID, 0.375 (9.52mm) OD | 0.400 (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Aluminum | ||
625-60ABT3HEATSINK FOR 25MM BGA |
2728 | QRF |
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Datasheet |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.600 (15.24mm) | - | 8.00°C/W @ 200 LFM | - | Aluminum | ||
DV-T268-101E-TRTO-268 HEAT SINK /POLY TAPE |
3934 | QRF |
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Datasheet |
Tape & Reel (TR) | D | Active | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.220 (30.99mm) | - | 0.400 (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Aluminum | ||
660-29ABT3HEATSINK EXTRUSION 37MM |
3485 | QRF |
ДобавитьРасследования |
Datasheet |
Bulk | 660 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.530 (38.86mm) | 1.530 (38.86mm) | - | 0.285 (7.24mm) | 2.0W @ 30°C | 7.00°C/W @ 100 LFM | - | Aluminum |