Домой > Продукты > Соединитель, соединитель > IC, транзисторная розетка
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Сбросить
Заявления
Последствия:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-8600-210C

10-8600-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3263 QRF
- +

Добавить

Расследования

10-8600-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8620-210C

10-8620-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3324 QRF
- +

Добавить

Расследования

10-8620-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8723-210C

10-8723-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2830 QRF
- +

Добавить

Расследования

10-8723-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8745-210C

10-8745-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2177 QRF
- +

Добавить

Расследования

10-8745-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8796-210C

10-8796-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2396 QRF
- +

Добавить

Расследования

10-8796-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8800-210C

10-8800-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3449 QRF
- +

Добавить

Расследования

10-8800-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8810-210C

10-8810-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2056 QRF
- +

Добавить

Расследования

10-8810-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8828-210C

10-8828-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3932 QRF
- +

Добавить

Расследования

10-8828-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8850-210C

10-8850-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3493 QRF
- +

Добавить

Расследования

10-8850-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8875-210C

10-8875-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3669 QRF
- +

Добавить

Расследования

10-8875-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109565

1109565

SERIES 8XXX ELEV SCKT .300/.600

Aries Electronics

3868 QRF
- +

Добавить

Расследования

1109565

Datasheet

- - Active - - - - - - - - - - - - - -
14-8500-311C

14-8500-311C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2330 QRF
- +

Добавить

Расследования

14-8500-311C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8500-611C

14-8500-611C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2046 QRF
- +

Добавить

Расследования

14-8500-611C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8325-311C

16-8325-311C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3240 QRF
- +

Добавить

Расследования

16-8325-311C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-811250-610C

18-811250-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2061 QRF
- +

Добавить

Расследования

18-811250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8750-310C

20-8750-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2586 QRF
- +

Добавить

Расследования

20-8750-310C

Datasheet

- - Active - - - - - - - - - - - - - -
24-8190-610C

24-8190-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2746 QRF
- +

Добавить

Расследования

24-8190-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1108883-05

1108883-05

SERIES 0517 PIN-LINE VERTISOCKET

Aries Electronics

3971 QRF
- +

Добавить

Расследования

1108883-05

Datasheet

- - Active - - - - - - - - - - - - - -
181-PGM18041-10

181-PGM18041-10

CONN SOCKET PGA GOLD

Aries Electronics

3620 QRF
- +

Добавить

Расследования

181-PGM18041-10

Datasheet

Bulk PGM Obsolete PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
192-PG17043-10H

192-PG17043-10H

CONN SOCKET PGA GOLD

Aries Electronics

2184 QRF
- +

Добавить

Расследования

192-PG17043-10H

Datasheet

Bulk PG Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Records«Prev1... 815816817818819820821822...1100Next»
Запрос котировок
Номер запчасти
Количество
Связь
Электронная почта
Компания
Замечания
  • Шэньчжэньская компания по производству чипов