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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D83084B-46

D83084B-46

CONN SOCKET PLCC 84POS TIN

Harwin Inc.

3147 QRF
- +

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D83084B-46

Datasheet

Tube D830 Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
D83084C-46

D83084C-46

CONN SOCKET PLCC 84POS TIN

Harwin Inc.

3022 QRF
- +

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D83084C-46

Datasheet

Tube D830 Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
D95006-42

D95006-42

CONN IC DIP SOCKET 6POS GOLD

Harwin Inc.

3669 QRF
- +

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D95006-42

Datasheet

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95016-42

D95016-42

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

3280 QRF
- +

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D95016-42

Datasheet

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95018-42

D95018-42

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

3391 QRF
- +

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D95018-42

Datasheet

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95032-42

D95032-42

CONN IC DIP SOCKET 32POS GOLD

Harwin Inc.

3114 QRF
- +

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D95032-42

Datasheet

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95A22-42

D95A22-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

3398 QRF
- +

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D95A22-42

Datasheet

Bulk D95 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95A24-42

D95A24-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

3649 QRF
- +

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D95A24-42

Datasheet

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95A48-42

D95A48-42

CONN IC DIP SOCKET 48POS GOLD

Harwin Inc.

2050 QRF
- +

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D95A48-42

Datasheet

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D95B24-42

D95B24-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

3304 QRF
- +

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D95B24-42

Datasheet

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
2676-9318-00-2401

2676-9318-00-2401

BGA SOCKET 1MM 676 POS 26X26

3M

2369 QRF
- +

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- - Obsolete BGA - - - - - - - - - - - - -
1554116-2

1554116-2

CONN SOCKET LGA 1356POS GOLD

TE Connectivity AMP Connectors

3933 QRF
- +

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1554116-2

Datasheet

Tray - Obsolete LGA 1356 (32 x 41) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1554116-3

1554116-3

CONN SOCKET LGA 1356POS GOLD

TE Connectivity AMP Connectors

2557 QRF
- +

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1554116-3

Datasheet

Tray - Obsolete LGA 1356 (32 x 41) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1939737-1

1939737-1

CONN SOCKET LGA 1366POS

TE Connectivity AMP Connectors

2987 QRF
- +

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Tray - Obsolete LGA 1366 (32 x 41) - - - - - - - - - - - -
2069965-1

2069965-1

CONN SOCKET LGA 1155POS GOLD

TE Connectivity AMP Connectors

3263 QRF
- +

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2069965-1

Datasheet

Bulk,Bulk - Active LGA 1155 (40 x 40) 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
506-AG11D

506-AG11D

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

3355 QRF
- +

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506-AG11D

Datasheet

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
506-AG11D-ES

506-AG11D-ES

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

2984 QRF
- +

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Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
5-1437530-2

5-1437530-2

CONN IC SIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

2855 QRF
- +

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5-1437530-2

Datasheet

Tube 500 Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead - Brass Polyester
516-AG7D

516-AG7D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

3326 QRF
- +

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Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy Polyester
524-AG11D-ES

524-AG11D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

2062 QRF
- +

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Расследования

524-AG11D-ES

Datasheet

Bulk 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
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