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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1825109-3

1825109-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

2120 QRF
- +

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1825109-3

Datasheet

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825276-2

1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

2652 QRF
- +

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1825276-2

Datasheet

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825376-2

1825376-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

2901 QRF
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1825376-2

Datasheet

Tube,Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
2-821949-4

2-821949-4

CONN SOCKET PQFP 100POS TIN-LEAD

TE Connectivity AMP Connectors

2548 QRF
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2-821949-4

Datasheet

Tube - Obsolete QFP 100 (4 x 25) 0.050 (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050 (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
110-024-000

110-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

2036 QRF
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Bulk 100 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
130-024-000

130-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

2535 QRF
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Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
130-028-000

130-028-000

CONN IC DIP SOCKET 28POS GOLD

3M

2568 QRF
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Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
300-014-000

300-014-000

CONN SOCKET SIP 14POS GOLD

3M

3234 QRF
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- 300 Obsolete SIP 14 (1 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
300-032-000

300-032-000

CONN SOCKET SIP 32POS GOLD

3M

2468 QRF
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- 300 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
400-028-000

400-028-000

CONN IC DIP SOCKET 28POS GOLD

3M

2636 QRF
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- 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
400-032-000

400-032-000

CONN IC DIP SOCKET 32POS GOLD

3M

3776 QRF
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- 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
400-040-000

400-040-000

CONN IC DIP SOCKET 40POS GOLD

3M

2974 QRF
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- 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
500-032-000

500-032-000

CONN SOCKET SIP 32POS GOLD

3M

3542 QRF
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- - Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
210-33-628-41-101000

210-33-628-41-101000

SOCKET IC CLOSED FRM .300 28POS

Mill-Max Manufacturing Corp.

2785 QRF
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Tube 210 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-33-640-41-101000

210-33-640-41-101000

SOCKET IC CLOSED FRM .600 28POS

Mill-Max Manufacturing Corp.

3301 QRF
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Tube 210 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
SIP1X06-014BLF

SIP1X06-014BLF

CONN SOCKET SIP 6POS TIN

Amphenol ICC (FCI)

2152 QRF
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SIP1X06-014BLF

Datasheet

Bulk SIP1x Obsolete SIP 6 (1 x 6) 0.100 (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
SIP1X05-014BLF

SIP1X05-014BLF

CONN SOCKET SIP 5POS TIN

Amphenol ICC (FCI)

2853 QRF
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SIP1X05-014BLF

Datasheet

Bulk SIP1x Obsolete SIP 5 (1 x 5) 0.100 (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
SIP1X08-011BLF

SIP1X08-011BLF

CONN SOCKET SIP 8POS GOLD

Amphenol ICC (FCI)

3812 QRF
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SIP1X08-011BLF

Datasheet

Bulk SIP1x Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
SIP1X07-014BLF

SIP1X07-014BLF

CONN SOCKET SIP 7POS TIN

Amphenol ICC (FCI)

2500 QRF
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SIP1X07-014BLF

Datasheet

Bulk SIP1x Obsolete SIP 7 (1 x 7) 0.100 (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
SIP1X06-011BLF

SIP1X06-011BLF

CONN SOCKET SIP 6POS GOLD

Amphenol ICC (FCI)

3065 QRF
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SIP1X06-011BLF

Datasheet

Bulk SIP1x Obsolete SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
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