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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-356M26-001148

514-83-356M26-001148

CONN SOCKET BGA 356POS GOLD

Preci-Dip

2200 QRF
- +

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Расследования

514-83-356M26-001148

Datasheet

Bulk 514 Active BGA 356 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-296-19-131135

550-10-296-19-131135

PGA SOLDER TAIL

Preci-Dip

2128 QRF
- +

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550-10-296-19-131135

Datasheet

Bulk 550 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-142-15-085003

510-13-142-15-085003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2041 QRF
- +

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510-13-142-15-085003

Datasheet

Bulk 510 Active PGA 142 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
175-PGM16003-11H

175-PGM16003-11H

CONN SOCKET PGA GOLD

Aries Electronics

3818 QRF
- +

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175-PGM16003-11H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
175-PGM16008-11

175-PGM16008-11

CONN SOCKET PGA GOLD

Aries Electronics

2970 QRF
- +

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175-PGM16008-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-83-360M19-001148

514-83-360M19-001148

CONN SOCKET BGA 360POS GOLD

Preci-Dip

3393 QRF
- +

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514-83-360M19-001148

Datasheet

Bulk 514 Active BGA 360 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-357M19-001152

550-10-357M19-001152

BGA SOLDER TAIL

Preci-Dip

2056 QRF
- +

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550-10-357M19-001152

Datasheet

Bulk 550 Active BGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
50-9503-21

50-9503-21

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

2102 QRF
- +

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50-9503-21

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
50-9503-31

50-9503-31

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

2342 QRF
- +

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50-9503-31

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6574-16

32-6574-16

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3404 QRF
- +

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32-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-13-144-12-000001

510-13-144-12-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3994 QRF
- +

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510-13-144-12-000001

Datasheet

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-12-000002

510-13-144-12-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3758 QRF
- +

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Расследования

510-13-144-12-000002

Datasheet

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-12-000003

510-13-144-12-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2807 QRF
- +

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Расследования

510-13-144-12-000003

Datasheet

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-13-041001

510-13-144-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2760 QRF
- +

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Расследования

510-13-144-13-041001

Datasheet

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-13-041002

510-13-144-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3380 QRF
- +

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Расследования

510-13-144-13-041002

Datasheet

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-13-041003

510-13-144-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2620 QRF
- +

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Расследования

510-13-144-13-041003

Datasheet

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-15-082002

510-13-144-15-082002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2959 QRF
- +

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Расследования

510-13-144-15-082002

Datasheet

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-15-082003

510-13-144-15-082003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2936 QRF
- +

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Расследования

510-13-144-15-082003

Datasheet

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-144-15-082001

510-13-144-15-082001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3804 QRF
- +

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Расследования

510-13-144-15-082001

Datasheet

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-360M19-001152

550-10-360M19-001152

BGA SOLDER TAIL

Preci-Dip

2211 QRF
- +

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Расследования

550-10-360M19-001152

Datasheet

Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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