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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-6508-312

40-6508-312

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3262 QRF
- +

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40-6508-312

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-41-240-17-061002

510-41-240-17-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3964 QRF
- +

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510-41-240-17-061002

Datasheet

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-240-17-061002

510-91-240-17-061002

SOCKET SOLDERTAIL 240-PGA

Mill-Max Manufacturing Corp.

2033 QRF
- +

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Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-240-17-061001

510-91-240-17-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2273 QRF
- +

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Расследования

510-91-240-17-061001

Datasheet

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-240-17-061003

510-91-240-17-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3266 QRF
- +

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510-91-240-17-061003

Datasheet

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-241-18-075001

510-91-241-18-075001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3510 QRF
- +

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510-91-241-18-075001

Datasheet

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-241-18-075002

510-91-241-18-075002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3755 QRF
- +

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510-91-241-18-075002

Datasheet

Tube 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-241-18-075003

510-91-241-18-075003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2241 QRF
- +

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Расследования

510-91-241-18-075003

Datasheet

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-109-12-051001

510-13-109-12-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3943 QRF
- +

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510-13-109-12-051001

Datasheet

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-109-12-051002

510-13-109-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2992 QRF
- +

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Расследования

510-13-109-12-051002

Datasheet

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-109-12-051003

510-13-109-12-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3130 QRF
- +

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Расследования

510-13-109-12-051003

Datasheet

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6508-21

32-6508-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2673 QRF
- +

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32-6508-21

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-31

32-6508-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3977 QRF
- +

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Расследования

32-6508-31

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
44-3570-11

44-3570-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3866 QRF
- +

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44-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3571-11

44-3571-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3396 QRF
- +

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Расследования

44-3571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3572-11

44-3572-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3385 QRF
- +

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Расследования

44-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3573-11

44-3573-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2737 QRF
- +

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Расследования

44-3573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3574-11

44-3574-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3531 QRF
- +

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Расследования

44-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3575-11

44-3575-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3444 QRF
- +

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Расследования

44-3575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6570-11

44-6570-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2627 QRF
- +

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Расследования

44-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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