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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
44-6551-11

44-6551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3757 QRF
- +

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44-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6552-11

44-6552-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2342 QRF
- +

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44-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3554-11

44-3554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2437 QRF
- +

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44-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6553-11

44-6553-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3162 QRF
- +

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44-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6554-11

44-6554-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

2497 QRF
- +

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44-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-93-128-13-041003

510-93-128-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2998 QRF
- +

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510-93-128-13-041003

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-128-13-041002

510-93-128-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3501 QRF
- +

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510-93-128-13-041002

Datasheet

Tube 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-101001

510-91-168-17-101001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2512 QRF
- +

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510-91-168-17-101001

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-101003

510-91-168-17-101003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2058 QRF
- +

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510-91-168-17-101003

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-105001

510-91-168-17-105001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2752 QRF
- +

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510-91-168-17-105001

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-105002

510-91-168-17-105002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3586 QRF
- +

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510-91-168-17-105002

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-168-17-105003

510-91-168-17-105003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3673 QRF
- +

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Расследования

510-91-168-17-105003

Datasheet

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-83-281-19-081117

514-83-281-19-081117

CONN SOCKET PGA 281POS GOLD

Preci-Dip

3607 QRF
- +

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514-83-281-19-081117

Datasheet

Bulk 514 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
324-13-164-41-002000

324-13-164-41-002000

SOCKET 4 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

3015 QRF
- +

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324-13-164-41-002000

Datasheet

Tube 324 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
84-PGM11010-41

84-PGM11010-41

CONN SOCKET PGA GOLD

Aries Electronics

2255 QRF
- +

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84-PGM11010-41

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-13-076-11-041001

510-13-076-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2232 QRF
- +

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510-13-076-11-041001

Datasheet

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-076-11-041002

510-13-076-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2394 QRF
- +

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Расследования

510-13-076-11-041002

Datasheet

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-076-11-041003

510-13-076-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3275 QRF
- +

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Расследования

510-13-076-11-041003

Datasheet

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-256M20-001101

558-10-256M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3192 QRF
- +

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Расследования

558-10-256M20-001101

Datasheet

Bulk 558 Active PGA 256 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-256M16-000101

558-10-256M16-000101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2137 QRF
- +

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Расследования

558-10-256M16-000101

Datasheet

Bulk 558 Active PGA 256 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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