Домой > Продукты > Соединитель, соединитель > IC, транзисторная розетка
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Сбросить
Заявления
Последствия:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-121-15-061002

510-91-121-15-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3192 QRF
- +

Добавить

Расследования

510-91-121-15-061002

Datasheet

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-124-13-041001

510-41-124-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3128 QRF
- +

Добавить

Расследования

510-41-124-13-041001

Datasheet

Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-056-09-041001

510-13-056-09-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2061 QRF
- +

Добавить

Расследования

510-13-056-09-041001

Datasheet

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-056-09-041002

510-13-056-09-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2921 QRF
- +

Добавить

Расследования

510-13-056-09-041002

Datasheet

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-056-09-041003

510-13-056-09-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2423 QRF
- +

Добавить

Расследования

510-13-056-09-041003

Datasheet

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-3551-11

40-3551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3350 QRF
- +

Добавить

Расследования

40-3551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3552-11

40-3552-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3484 QRF
- +

Добавить

Расследования

40-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3553-11

40-3553-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3368 QRF
- +

Добавить

Расследования

40-3553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6551-11

40-6551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

2388 QRF
- +

Добавить

Расследования

40-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6552-11

40-6552-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3837 QRF
- +

Добавить

Расследования

40-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6553-11

40-6553-11

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2022 QRF
- +

Добавить

Расследования

40-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3554-11

40-3554-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

2599 QRF
- +

Добавить

Расследования

40-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
38-0508-21

38-0508-21

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2928 QRF
- +

Добавить

Расследования

38-0508-21

Datasheet

Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
38-0508-31

38-0508-31

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2842 QRF
- +

Добавить

Расследования

38-0508-31

Datasheet

Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-93-096-11-041001

510-93-096-11-041001

SOCKET SOLDERTAIL 96-PGA

Mill-Max Manufacturing Corp.

3426 QRF
- +

Добавить

Расследования

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-096-11-041002

510-93-096-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2605 QRF
- +

Добавить

Расследования

510-93-096-11-041002

Datasheet

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-096-11-041003

510-93-096-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2745 QRF
- +

Добавить

Расследования

510-93-096-11-041003

Datasheet

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-1508-21

38-1508-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3912 QRF
- +

Добавить

Расследования

38-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
38-1508-31

38-1508-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3323 QRF
- +

Добавить

Расследования

38-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-3570-11

32-3570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2879 QRF
- +

Добавить

Расследования

32-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 640641642643644645646647...1100Next»
Запрос котировок
Номер запчасти
Количество
Связь
Электронная почта
Компания
Замечания
  • Шэньчжэньская компания по производству чипов