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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-3572-10

40-3572-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2475 QRF
- +

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40-3572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3573-10

40-3573-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2174 QRF
- +

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40-3573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3575-10

40-3575-10

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3446 QRF
- +

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40-3575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6571-10

40-6571-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2707 QRF
- +

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40-6571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6573-10

40-6573-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3198 QRF
- +

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40-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6575-10

40-6575-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3869 QRF
- +

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40-6575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
116-43-310-61-001000

116-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3749 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
116-93-310-61-001000

116-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3139 QRF
- +

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Расследования

Tube * Active - - - - - - - - - - - - - -
27-0501-21

27-0501-21

CONN SOCKET SIP 27POS GOLD

Aries Electronics

2448 QRF
- +

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Расследования

27-0501-21

Datasheet

Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-0501-31

27-0501-31

CONN SOCKET SIP 27POS GOLD

Aries Electronics

2822 QRF
- +

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27-0501-31

Datasheet

Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0501-20

36-0501-20

CONN SOCKET SIP 36POS TIN

Aries Electronics

2766 QRF
- +

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Расследования

36-0501-20

Datasheet

Bulk 501 Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0501-30

36-0501-30

CONN SOCKET SIP 36POS TIN

Aries Electronics

3363 QRF
- +

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Расследования

36-0501-30

Datasheet

Bulk 501 Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
156-PGM16012-10

156-PGM16012-10

CONN SOCKET PGA GOLD

Aries Electronics

2518 QRF
- +

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156-PGM16012-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6556-21

24-6556-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2502 QRF
- +

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Расследования

24-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
24-6556-31

24-6556-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2956 QRF
- +

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24-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
22-3503-21

22-3503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3272 QRF
- +

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Расследования

22-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-3503-31

22-3503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3494 QRF
- +

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Расследования

22-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-526-11

40-526-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3654 QRF
- +

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Расследования

40-526-11

Datasheet

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-648-41-004000

612-43-648-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3790 QRF
- +

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Расследования

612-43-648-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-004000

612-93-648-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3985 QRF
- +

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Расследования

612-93-648-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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