Домой > Продукты > Соединитель, соединитель > IC, транзисторная розетка
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Сбросить
Заявления
Последствия:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
39-0501-30

39-0501-30

CONN SOCKET SIP 39POS TIN

Aries Electronics

3293 QRF
- +

Добавить

Расследования

39-0501-30

Datasheet

Bulk 501 Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-211

20-3508-211

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2804 QRF
- +

Добавить

Расследования

20-3508-211

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-311

20-3508-311

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2141 QRF
- +

Добавить

Расследования

20-3508-311

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6621-30

24-6621-30

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2292 QRF
- +

Добавить

Расследования

24-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-3551-10

40-3551-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3040 QRF
- +

Добавить

Расследования

40-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3552-10

40-3552-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2322 QRF
- +

Добавить

Расследования

40-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3553-10

40-3553-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2489 QRF
- +

Добавить

Расследования

40-3553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6551-10

40-6551-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3481 QRF
- +

Добавить

Расследования

40-6551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6552-10

40-6552-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3937 QRF
- +

Добавить

Расследования

40-6552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6553-10

40-6553-10

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3244 QRF
- +

Добавить

Расследования

40-6553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3554-10

40-3554-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2409 QRF
- +

Добавить

Расследования

40-3554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
68-PGM10005-11H

68-PGM10005-11H

CONN SOCKET PGA GOLD

Aries Electronics

2312 QRF
- +

Добавить

Расследования

68-PGM10005-11H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
181-PGM15005-10

181-PGM15005-10

SOCKET IC PGA 181POS SOLDER

Aries Electronics

2334 QRF
- +

Добавить

Расследования

- PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
181-PGM18040-10

181-PGM18040-10

CONN SOCKET PGA GOLD

Aries Electronics

2731 QRF
- +

Добавить

Расследования

181-PGM18040-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-656-41-105000

117-43-656-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2657 QRF
- +

Добавить

Расследования

117-43-656-41-105000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-87-447-20-121111

517-87-447-20-121111

CONN SOCKET PGA 447POS GOLD

Preci-Dip

3088 QRF
- +

Добавить

Расследования

517-87-447-20-121111

Datasheet

Bulk 517 Active PGA 447 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-3570-10

32-3570-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3472 QRF
- +

Добавить

Расследования

32-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3571-10

32-3571-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2095 QRF
- +

Добавить

Расследования

32-3571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3572-10

32-3572-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2059 QRF
- +

Добавить

Расследования

32-3572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3573-10

32-3573-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2010 QRF
- +

Добавить

Расследования

32-3573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 542543544545546547548549...1100Next»
Запрос котировок
Номер запчасти
Количество
Связь
Электронная почта
Компания
Замечания
  • Шэньчжэньская компания по производству чипов