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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6501-20

48-6501-20

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

3178 QRF
- +

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48-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6501-30

48-6501-30

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

2620 QRF
- +

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48-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-6503-21

14-6503-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3563 QRF
- +

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14-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-6503-31

14-6503-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3956 QRF
- +

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14-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
410-91-214-10-002000

410-91-214-10-002000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3091 QRF
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410-91-214-10-002000

Datasheet

Tube 410 Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-114-41-005000

317-93-114-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3586 QRF
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317-93-114-41-005000

Datasheet

Bulk 317 Active SIP 14 (1 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-248-31-018000

714-43-248-31-018000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

2658 QRF
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714-43-248-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-320-41-012000

146-93-320-41-012000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2534 QRF
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146-93-320-41-012000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-320-41-012000

146-43-320-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2693 QRF
- +

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146-43-320-41-012000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-9503-20

20-9503-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3862 QRF
- +

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20-9503-20

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9503-30

20-9503-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3234 QRF
- +

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20-9503-30

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-0503-20

25-0503-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2581 QRF
- +

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25-0503-20

Datasheet

Bulk 0503 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
50-9518-10H

50-9518-10H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3204 QRF
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50-9518-10H

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-41-640-41-001000

115-41-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2276 QRF
- +

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115-41-640-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-640-41-001000

115-91-640-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

3768 QRF
- +

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115-91-640-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-71000-10

16-71000-10

CONN SOCKET SIP 16POS TIN

Aries Electronics

2014 QRF
- +

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16-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-7415-10

16-7415-10

CONN SOCKET SIP 16POS TIN

Aries Electronics

2766 QRF
- +

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16-7415-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-100-15-001101

550-10-100-15-001101

PGA SOLDER TAIL

Preci-Dip

3788 QRF
- +

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550-10-100-15-001101

Datasheet

Bulk 550 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-316-31-018000

614-41-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2642 QRF
- +

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614-41-316-31-018000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-316-31-018000

614-91-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3845 QRF
- +

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614-91-316-31-018000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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