Домой > Продукты > Соединитель, соединитель > IC, транзисторная розетка
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Сбросить
Заявления
Последствия:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3518-101

28-3518-101

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3409 QRF
- +

Добавить

Расследования

28-3518-101

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-101

28-6518-101

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3918 QRF
- +

Добавить

Расследования

28-6518-101

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2820-90C

08-2820-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3363 QRF
- +

Добавить

Расследования

08-2820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2822-90C

08-2822-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3062 QRF
- +

Добавить

Расследования

08-2822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2823-90C

08-2823-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3222 QRF
- +

Добавить

Расследования

08-2823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-T-A1

APA-628-T-A1

ADAPTER PLUG

Samtec Inc.

2923 QRF
- +

Добавить

Расследования

Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
38-1518-11

38-1518-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2950 QRF
- +

Добавить

Расследования

38-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-320-T-N

APA-320-T-N

ADAPTER PLUG

Samtec Inc.

3980 QRF
- +

Добавить

Расследования

Tube APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
110-11-304-41-001000

110-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3049 QRF
- +

Добавить

Расследования

110-11-304-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-135-41-013000

346-93-135-41-013000

CONN SOCKET SIP 35POS GOLD

Mill-Max Manufacturing Corp.

3305 QRF
- +

Добавить

Расследования

346-93-135-41-013000

Datasheet

Bulk 346 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-0518-11

38-0518-11

CONN SOCKET SIP 38POS GOLD

Aries Electronics

3377 QRF
- +

Добавить

Расследования

38-0518-11

Datasheet

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-11

16-C195-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2970 QRF
- +

Добавить

Расследования

16-C195-11

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-11

16-C280-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2718 QRF
- +

Добавить

Расследования

16-C280-11

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-10

24-C212-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2683 QRF
- +

Добавить

Расследования

24-C212-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-10

24-C300-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3260 QRF
- +

Добавить

Расследования

24-C300-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-101H

24-3518-101H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2250 QRF
- +

Добавить

Расследования

24-3518-101H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-10H

16-C195-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3469 QRF
- +

Добавить

Расследования

16-C195-10H

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
XR2T2421N

XR2T2421N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

2597 QRF
- +

Добавить

Расследования

XR2T2421N

Datasheet

Bulk XR2 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Threaded Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled
114-93-304-41-117000

114-93-304-41-117000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2577 QRF
- +

Добавить

Расследования

114-93-304-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-304-41-117000

114-43-304-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3094 QRF
- +

Добавить

Расследования

114-43-304-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 221222223224225226227228...1100Next»
Запрос котировок
Номер запчасти
Количество
Связь
Электронная почта
Компания
Замечания
  • Шэньчжэньская компания по производству чипов