Домой > Продукты > Соединитель, соединитель > IC, транзисторная розетка
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Сбросить
Заявления
Последствия:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
36-0518-10H

36-0518-10H

CONN SOCKET SIP 36POS GOLD

Aries Electronics

3111 QRF
- +

Добавить

Расследования

36-0518-10H

Datasheet

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-1518-10H

36-1518-10H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2136 QRF
- +

Добавить

Расследования

36-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-3513-10

30-3513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3346 QRF
- +

Добавить

Расследования

30-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-422-T-A1

APA-422-T-A1

ADAPTER PLUG

Samtec Inc.

2323 QRF
- +

Добавить

Расследования

Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-314-G-J

APA-314-G-J

ADAPTER PLUG

Samtec Inc.

3577 QRF
- +

Добавить

Расследования

Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
28-6511-10

28-6511-10

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

2916 QRF
- +

Добавить

Расследования

28-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9513-10

20-9513-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3849 QRF
- +

Добавить

Расследования

20-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-6513-10T

30-6513-10T

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2498 QRF
- +

Добавить

Расследования

30-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6503-20

08-6503-20

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2942 QRF
- +

Добавить

Расследования

08-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-6503-30

08-6503-30

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3216 QRF
- +

Добавить

Расследования

08-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-0513-11

19-0513-11

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3254 QRF
- +

Добавить

Расследования

19-0513-11

Datasheet

Bulk 0513 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0513-10H

22-0513-10H

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2620 QRF
- +

Добавить

Расследования

22-0513-10H

Datasheet

Bulk 0513 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-1518-10T

40-1518-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3341 QRF
- +

Добавить

Расследования

40-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-101

18-3518-101

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2843 QRF
- +

Добавить

Расследования

18-3518-101

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-87-650-41-001101

122-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2193 QRF
- +

Добавить

Расследования

122-87-650-41-001101

Datasheet

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-650-41-001101

123-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2437 QRF
- +

Добавить

Расследования

123-87-650-41-001101

Datasheet

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-108-12-051101

510-83-108-12-051101

CONN SOCKET PGA 108POS GOLD

Preci-Dip

3604 QRF
- +

Добавить

Расследования

510-83-108-12-051101

Datasheet

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-009101

116-87-652-41-009101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2712 QRF
- +

Добавить

Расследования

116-87-652-41-009101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-0513-11H

16-0513-11H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2746 QRF
- +

Добавить

Расследования

16-0513-11H

Datasheet

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
D95040-42

D95040-42

CONN IC DIP SOCKET 42POS GOLD

Harwin Inc.

3593 QRF
- +

Добавить

Расследования

D95040-42

Datasheet

Bulk D95 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Total 21991 Records«Prev1... 197198199200201202203204...1100Next»
Запрос котировок
Номер запчасти
Количество
Связь
Электронная почта
Компания
Замечания
  • Шэньчжэньская компания по производству чипов