Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3570-16

28-3570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2745 QRF
- +

  Add To Cart

  Inquiry Now

28-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6570-16

28-6570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3494 QRF
- +

  Add To Cart

  Inquiry Now

28-6570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6571-16

28-6571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3238 QRF
- +

  Add To Cart

  Inquiry Now

28-6571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6573-16

28-6573-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3707 QRF
- +

  Add To Cart

  Inquiry Now

28-6573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3571-16

28-3571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2819 QRF
- +

  Add To Cart

  Inquiry Now

28-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3572-16

28-3572-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2974 QRF
- +

  Add To Cart

  Inquiry Now

28-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3573-16

28-3573-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2415 QRF
- +

  Add To Cart

  Inquiry Now

28-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3574-16

28-3574-16

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3153 QRF
- +

  Add To Cart

  Inquiry Now

28-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-16

28-6572-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2518 QRF
- +

  Add To Cart

  Inquiry Now

28-6572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6574-16

28-6574-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3134 QRF
- +

  Add To Cart

  Inquiry Now

28-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-41-281-19-081002

510-41-281-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2115 QRF
- +

  Add To Cart

  Inquiry Now

510-41-281-19-081002

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081002

510-91-281-19-081002

SOCKET SOLDERTAIL 281-PGA

Mill-Max Manufacturing Corp.

3173 QRF
- +

  Add To Cart

  Inquiry Now

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081001

510-91-281-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3519 QRF
- +

  Add To Cart

  Inquiry Now

510-91-281-19-081001

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081003

510-91-281-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2077 QRF
- +

  Add To Cart

  Inquiry Now

510-91-281-19-081003

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-480M29-001166

550-10-480M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3829 QRF
- +

  Add To Cart

  Inquiry Now

550-10-480M29-001166

Datasheet

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-599-54-131111

517-83-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip

2914 QRF
- +

  Add To Cart

  Inquiry Now

517-83-599-54-131111

Datasheet

Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-2599-50-0602

210-2599-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 210

3M

3082 QRF
- +

  Add To Cart

  Inquiry Now

Box - Active - - - - - - - - - - - - - -
48-6503-21

48-6503-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2669 QRF
- +

  Add To Cart

  Inquiry Now

48-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6503-31

48-6503-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2100 QRF
- +

  Add To Cart

  Inquiry Now

48-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-292M20-001106

518-77-292M20-001106

CONN SOCKET PGA 292POS GOLD

Preci-Dip

2491 QRF
- +

  Add To Cart

  Inquiry Now

518-77-292M20-001106

Datasheet

Bulk 518 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
Total 21991 Records«Prev1... 685686687688689690691692...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • EA-CHIP INDUSTRY CO., LIMITED