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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
44-6572-11

44-6572-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

2802 QRF
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44-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6573-11

44-6573-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

2129 QRF
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44-6573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6574-11

44-6574-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

2238 QRF
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44-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6575-11

44-6575-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

2804 QRF
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44-6575-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6571-11

44-6571-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

3306 QRF
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44-6571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6556-31

48-6556-31

UNIV TEST SOCKET RECEPT 6556

Aries Electronics

2119 QRF
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- 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
24-6556-40

24-6556-40

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2675 QRF
- +

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24-6556-40

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
48-6556-21

48-6556-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3020 QRF
- +

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48-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
510-13-120-13-061002

510-13-120-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3075 QRF
- +

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510-13-120-13-061002

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-120-13-061003

510-13-120-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2313 QRF
- +

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510-13-120-13-061003

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-120-13-061001

510-13-120-13-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2340 QRF
- +

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510-13-120-13-061001

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
108-PGM12005-41

108-PGM12005-41

CONN SOCKET PGA GOLD

Aries Electronics

2761 QRF
- +

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108-PGM12005-41

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-11-132-14-071001

510-11-132-14-071001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2784 QRF
- +

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510-11-132-14-071001

Datasheet

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-419-19-111147

546-87-419-19-111147

CONN SOCKET PGA 419POS GOLD

Preci-Dip

3638 QRF
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546-87-419-19-111147

Datasheet

Bulk 546 Active PGA 419 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-209-17-081001

510-93-209-17-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3840 QRF
- +

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510-93-209-17-081001

Datasheet

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-209-17-081002

510-93-209-17-081002

SOCKET SOLDERTAIL 209-PGA

Mill-Max Manufacturing Corp.

2284 QRF
- +

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Tube 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-209-17-081003

510-93-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3902 QRF
- +

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510-93-209-17-081003

Datasheet

Tube 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-223-18-095002

510-93-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2656 QRF
- +

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510-93-223-18-095002

Datasheet

Tube 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-223-18-095001

510-93-223-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3576 QRF
- +

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510-93-223-18-095001

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-223-18-095003

510-93-223-18-095003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3911 QRF
- +

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510-93-223-18-095003

Datasheet

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED