Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
116-93-628-61-008000CONN IC SKT DBL |
2025 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
48-6820-90CCONN IC DIP SOCKET 48POS GOLD |
2933 | QRF |
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Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
48-6822-90CCONN IC DIP SOCKET 48POS GOLD |
2588 | QRF |
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Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
48-6823-90CCONN IC DIP SOCKET 48POS GOLD |
2143 | QRF |
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Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
510-91-064-10-051001SOCKET SOLDERTAIL 64-PGA |
2950 | QRF |
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Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | ||
510-91-064-08-000001SKT PGA SOLDRTL |
2320 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 64 (8 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-91-064-08-000002SKT PGA SOLDRTL |
2753 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 64 (8 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-91-064-08-000003SKT PGA SOLDRTL |
2802 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 64 (8 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-91-064-10-051002SKT PGA SOLDRTL |
3754 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-91-064-10-051003SKT PGA SOLDRTL |
2363 | QRF |
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Datasheet |
Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
116-43-432-61-003000CONN IC SKT DBL |
2553 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-43-632-61-003000CONN IC SKT DBL |
3677 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-432-61-003000CONN IC SKT DBL |
2727 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-632-61-003000CONN IC SKT DBL |
2601 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
546-83-223-18-091135CONN SOCKET PGA 223POS GOLD |
2826 | QRF |
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Datasheet |
Bulk | 546 | Active | PGA | 223 (18 x 18) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
546-83-223-18-091136CONN SOCKET PGA 223POS GOLD |
2326 | QRF |
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Datasheet |
Bulk | 546 | Active | PGA | 223 (18 x 18) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
110-13-316-61-801000CONN IC SKT DBL |
3152 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
40-6621-30CONN IC DIP SOCKET 40POS TIN |
2784 | QRF |
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Datasheet |
Bulk | 6621 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
110-13-320-61-801000CONN IC SKT DBL |
2461 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
111-43-650-61-001000CONN IC SKT DBL |
3953 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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