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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-628-61-008000

116-93-628-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2025 QRF
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48-6820-90C

48-6820-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2933 QRF
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48-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6822-90C

48-6822-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2588 QRF
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48-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6823-90C

48-6823-90C

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2143 QRF
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48-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-064-10-051001

510-91-064-10-051001

SOCKET SOLDERTAIL 64-PGA

Mill-Max Manufacturing Corp.

2950 QRF
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Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-08-000001

510-91-064-08-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2320 QRF
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510-91-064-08-000001

Datasheet

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-08-000002

510-91-064-08-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2753 QRF
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510-91-064-08-000002

Datasheet

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-08-000003

510-91-064-08-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2802 QRF
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510-91-064-08-000003

Datasheet

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-10-051002

510-91-064-10-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3754 QRF
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510-91-064-10-051002

Datasheet

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-064-10-051003

510-91-064-10-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2363 QRF
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510-91-064-10-051003

Datasheet

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-432-61-003000

116-43-432-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2553 QRF
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116-43-632-61-003000

116-43-632-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3677 QRF
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116-93-432-61-003000

116-93-432-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2727 QRF
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116-93-632-61-003000

116-93-632-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2601 QRF
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546-83-223-18-091135

546-83-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2826 QRF
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546-83-223-18-091135

Datasheet

Bulk 546 Active PGA 223 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-223-18-091136

546-83-223-18-091136

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2326 QRF
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546-83-223-18-091136

Datasheet

Bulk 546 Active PGA 223 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-13-316-61-801000

110-13-316-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3152 QRF
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40-6621-30

40-6621-30

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

2784 QRF
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40-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-320-61-801000

110-13-320-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2461 QRF
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111-43-650-61-001000

111-43-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3953 QRF
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  • EA-CHIP INDUSTRY CO., LIMITED