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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6571-10

48-6571-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2140 QRF
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48-6571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6572-10

48-6572-10

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3297 QRF
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48-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6573-10

48-6573-10

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2065 QRF
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48-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6575-10

48-6575-10

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2436 QRF
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48-6575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6574-10

48-6574-10

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3985 QRF
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48-6574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3574-10

48-3574-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2616 QRF
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48-3574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6570-10

48-6570-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3124 QRF
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48-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
110-43-950-61-001000

110-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3774 QRF
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110-93-950-61-001000

110-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3497 QRF
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APA-628-G-Q

APA-628-G-Q

ADAPTER PLUG

Samtec Inc.

2162 QRF
- +

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Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-91-073-11-042001

510-91-073-11-042001

SOCKET SOLDERTAIL 73-PGA

Mill-Max Manufacturing Corp.

2321 QRF
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Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-061001

510-91-073-11-061001

SOCKET SOLDERTAIL 73-PGA

Mill-Max Manufacturing Corp.

3119 QRF
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Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-042002

510-91-073-11-042002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2634 QRF
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510-91-073-11-042002

Datasheet

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-042003

510-91-073-11-042003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3809 QRF
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510-91-073-11-042003

Datasheet

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-061002

510-91-073-11-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3145 QRF
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510-91-073-11-061002

Datasheet

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-061003

510-91-073-11-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2299 QRF
- +

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510-91-073-11-061003

Datasheet

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-324-61-001000

116-43-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2059 QRF
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116-43-424-61-001000

116-43-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3400 QRF
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116-43-624-61-001000

116-43-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2821 QRF
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116-93-324-61-001000

116-93-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3907 QRF
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Tube * Active - - - - - - - - - - - - - -
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  • EA-CHIP INDUSTRY CO., LIMITED