Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
517-83-370-19-121111CONN SOCKET PGA 370POS GOLD |
2579 | QRF |
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Datasheet |
Bulk | 517 | Active | PGA | 370 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
30-0511-11CONN SOCKET SIP 30POS GOLD |
3142 | QRF |
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Datasheet |
Bulk | 511 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
117-43-620-61-105000CONN IC SKT DBL |
3974 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
550-10-292M20-001166BGA PIN ADAPTER 1.27MM SMD |
2443 | QRF |
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Datasheet |
Bulk | 550 | Active | BGA | 292 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | |
123-13-652-41-001000CONN IC DIP SOCKET 52POS GOLD |
2292 | QRF |
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Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
127-93-664-41-003000CONN IC DIP SOCKET 64POS GOLD |
2130 | QRF |
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Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
127-43-664-41-003000CONN IC SKT DBL |
3777 | QRF |
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Datasheet |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
116-43-322-61-001000CONN IC SKT DBL |
2493 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-43-422-61-001000CONN IC SKT DBL |
3136 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-322-61-001000CONN IC SKT DBL |
2202 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-422-61-001000CONN IC SKT DBL |
3599 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
614-83-181-15-051112CONN SOCKET PGA 181POS GOLD |
3390 | QRF |
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Datasheet |
Bulk | 614 | Active | PGA | 181 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
32-0508-21CONN SOCKET SIP 32POS GOLD |
2154 | QRF |
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Datasheet |
Bulk | 508 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
32-0508-31CONN SOCKET SIP 32POS GOLD |
2597 | QRF |
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Datasheet |
Bulk | 508 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
510-93-145-15-081001CONN SOCKET PGA 145POS GOLD |
2527 | QRF |
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Datasheet |
Tube | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
510-43-145-15-081001SKT PGA SOLDRTL |
2841 | QRF |
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Datasheet |
Tube | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
32-1508-21CONN IC DIP SOCKET 32POS GOLD |
2625 | QRF |
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Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
32-1508-31CONN IC DIP SOCKET 32POS GOLD |
2600 | QRF |
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Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | |
24-3508-212CONN IC DIP SOCKET 24POS GOLD |
3126 | QRF |
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Datasheet |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
24-3508-312CONN IC DIP SOCKET 24POS GOLD |
3832 | QRF |
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Datasheet |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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