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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
84-PGM13053-50

84-PGM13053-50

CONN SOCKET PGA GOLD

Aries Electronics

2784 QRF
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84-PGM13053-50

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-169-17-101101

550-10-169-17-101101

PGA SOLDER TAIL

Preci-Dip

3536 QRF
- +

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550-10-169-17-101101

Datasheet

Bulk 550 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-539-20-101111

517-87-539-20-101111

CONN SOCKET PGA 539POS GOLD

Preci-Dip

3328 QRF
- +

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517-87-539-20-101111

Datasheet

Bulk 517 Active PGA 539 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
104-13-964-41-780000

104-13-964-41-780000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2034 QRF
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104-13-964-41-780000

Datasheet

Tube 104 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
32-3551-11

32-3551-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2183 QRF
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32-3551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3552-11

32-3552-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2814 QRF
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32-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3553-11

32-3553-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

3523 QRF
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32-3553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6551-11

32-6551-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

3172 QRF
- +

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32-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6552-11

32-6552-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

3292 QRF
- +

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32-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3554-11

32-3554-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

2943 QRF
- +

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32-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
712-13-164-41-001000

712-13-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

2841 QRF
- +

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712-13-164-41-001000

Datasheet

Tube 712 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-256M16-000148

514-87-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

3374 QRF
- +

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514-87-256M16-000148

Datasheet

Bulk 514 Active BGA 256 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-256M20-001148

514-87-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2348 QRF
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514-87-256M20-001148

Datasheet

Bulk 514 Active BGA 256 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-192M16-001101

558-10-192M16-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3619 QRF
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558-10-192M16-001101

Datasheet

Bulk 558 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
115-43-648-61-001000

115-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3049 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
115-93-648-61-001000

115-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2388 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
510-93-045-08-005001

510-93-045-08-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2795 QRF
- +

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510-93-045-08-005001

Datasheet

Bulk 510 Active PGA 45 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-045-08-005002

510-93-045-08-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2811 QRF
- +

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510-93-045-08-005002

Datasheet

Bulk 510 Active PGA 45 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-045-08-005003

510-93-045-08-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3670 QRF
- +

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510-93-045-08-005003

Datasheet

Bulk 510 Active PGA 45 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-6621-30

38-6621-30

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

3918 QRF
- +

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38-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED