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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
144-PGM13095-10

144-PGM13095-10

CONN SOCKET PGA GOLD

Aries Electronics

2961 QRF
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144-PGM13095-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
144-PGM15025-10

144-PGM15025-10

CONN SOCKET PGA GOLD

Aries Electronics

3883 QRF
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144-PGM15025-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
123-11-642-41-001000

123-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2529 QRF
- +

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123-11-642-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-650-41-001000

612-93-650-41-001000

SOCKET CARRIER SLDRTL .600 50POS

Mill-Max Manufacturing Corp.

2998 QRF
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612-93-650-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-650-41-001000

612-43-650-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3404 QRF
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612-43-650-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-9513-11H

40-9513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2025 QRF
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40-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
546-83-182-14-001135

546-83-182-14-001135

CONN SOCKET PGA 182POS GOLD

Preci-Dip

3912 QRF
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546-83-182-14-001135

Datasheet

Bulk 546 Active PGA 182 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-182-14-001136

546-83-182-14-001136

CONN SOCKET PGA 182POS GOLD

Preci-Dip

3486 QRF
- +

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546-83-182-14-001136

Datasheet

Bulk 546 Active PGA 182 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
126-93-650-41-001000

126-93-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3692 QRF
- +

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126-93-650-41-001000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-650-41-001000

126-43-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2004 QRF
- +

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126-43-650-41-001000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-61-003000

116-43-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2945 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
116-93-306-61-003000

116-93-306-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2714 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
121-13-648-41-001000

121-13-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

2733 QRF
- +

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121-13-648-41-001000

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-316-61-003000

115-44-316-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3523 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
145-PGM15023-10

145-PGM15023-10

CONN SOCKET PGA GOLD

Aries Electronics

3416 QRF
- +

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145-PGM15023-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
145-PGM15024-10

145-PGM15024-10

CONN SOCKET PGA GOLD

Aries Electronics

2510 QRF
- +

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145-PGM15024-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-99-424-61-001000

110-99-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2304 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
123-93-318-41-801000

123-93-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3750 QRF
- +

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123-93-318-41-801000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-964-31-018000

614-41-964-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3990 QRF
- +

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614-41-964-31-018000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-964-31-018000

614-91-964-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3037 QRF
- +

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614-91-964-31-018000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED