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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-8459-610C

28-8459-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2685 QRF
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28-8459-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8472-610C

28-8472-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2240 QRF
- +

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28-8472-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8495-610C

28-8495-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3146 QRF
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28-8495-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8500-610C

28-8500-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3010 QRF
- +

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28-8500-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8600-610C

28-8600-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3611 QRF
- +

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28-8600-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8620-610C

28-8620-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3025 QRF
- +

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28-8620-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8670-610C

28-8670-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2293 QRF
- +

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28-8670-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8675-610C

28-8675-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2388 QRF
- +

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28-8675-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8680-610C

28-8680-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3062 QRF
- +

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28-8680-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8700-610C

28-8700-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2144 QRF
- +

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28-8700-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8725-610C

28-8725-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3537 QRF
- +

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28-8725-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8750-610C

28-8750-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3250 QRF
- +

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28-8750-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8800-610C

28-8800-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3640 QRF
- +

  Add To Cart

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28-8800-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-8830-610C

28-8830-610C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2450 QRF
- +

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28-8830-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-310-61-003000

116-43-310-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3332 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
116-93-310-61-003000

116-93-310-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3309 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
110-13-210-61-001000

110-13-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2548 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
612-41-650-41-004000

612-41-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2812 QRF
- +

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612-41-650-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-650-41-004000

612-91-650-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2415 QRF
- +

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612-91-650-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6508-301

40-6508-301

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3641 QRF
- +

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40-6508-301

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED