> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-8600-610C

24-8600-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3804 QRF
- +

  카트에 추가

  지금 질의

24-8600-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8700-610C

24-8700-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3841 QRF
- +

  카트에 추가

  지금 질의

24-8700-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8750-610C

24-8750-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3793 QRF
- +

  카트에 추가

  지금 질의

24-8750-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8900-610C

24-8900-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3442 QRF
- +

  카트에 추가

  지금 질의

24-8900-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
605-41-432-11-480000

605-41-432-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3832 QRF
- +

  카트에 추가

  지금 질의

605-41-432-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-632-11-480000

605-41-632-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2833 QRF
- +

  카트에 추가

  지금 질의

605-41-632-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-432-11-480000

605-91-432-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2667 QRF
- +

  카트에 추가

  지금 질의

605-91-432-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-632-11-480000

605-91-632-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2838 QRF
- +

  카트에 추가

  지금 질의

605-91-632-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-322-41-002000

126-93-322-41-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2188 QRF
- +

  카트에 추가

  지금 질의

126-93-322-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-422-41-002000

126-93-422-41-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2427 QRF
- +

  카트에 추가

  지금 질의

126-93-422-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-322-41-002000

126-43-322-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3571 QRF
- +

  카트에 추가

  지금 질의

126-43-322-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-422-41-002000

126-43-422-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2575 QRF
- +

  카트에 추가

  지금 질의

126-43-422-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
316-93-132-41-006000

316-93-132-41-006000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

2161 QRF
- +

  카트에 추가

  지금 질의

316-93-132-41-006000

Datasheet

Tube 316 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-640-41-780000

104-13-640-41-780000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3079 QRF
- +

  카트에 추가

  지금 질의

104-13-640-41-780000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
123-91-432-41-001000

123-91-432-41-001000

SOCKET IC OPEN 3 LVL .400 32POS

Mill-Max Manufacturing Corp.

2913 QRF
- +

  카트에 추가

  지금 질의

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-632-41-001000

123-91-632-41-001000

SOCKET IC OPEN 3 LVL .600 32POS

Mill-Max Manufacturing Corp.

3326 QRF
- +

  카트에 추가

  지금 질의

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-952-41-001000

115-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3893 QRF
- +

  카트에 추가

  지금 질의

115-41-952-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-952-41-001000

115-91-952-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

3486 QRF
- +

  카트에 추가

  지금 질의

115-91-952-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-432-41-001000

123-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3750 QRF
- +

  카트에 추가

  지금 질의

123-41-432-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-632-41-001000

123-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2294 QRF
- +

  카트에 추가

  지금 질의

123-41-632-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 496497498499500501502503...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사