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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
25-7700-10

25-7700-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3834 QRF
- +

  카트에 추가

  지금 질의

25-7700-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7750-10

25-7750-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2070 QRF
- +

  카트에 추가

  지금 질의

25-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7770-10

25-7770-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2846 QRF
- +

  카트에 추가

  지금 질의

25-7770-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7787-10

25-7787-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2021 QRF
- +

  카트에 추가

  지금 질의

25-7787-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7800-10

25-7800-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3569 QRF
- +

  카트에 추가

  지금 질의

25-7800-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7846-10

25-7846-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3780 QRF
- +

  카트에 추가

  지금 질의

25-7846-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7950-10

25-7950-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2193 QRF
- +

  카트에 추가

  지금 질의

25-7950-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-652-41-001000

110-13-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3627 QRF
- +

  카트에 추가

  지금 질의

110-13-652-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-T-N

APA-648-T-N

ADAPTER PLUG

Samtec Inc.

3557 QRF
- +

  카트에 추가

  지금 질의

Tube APA Active - 48 (2 x 24) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
115-93-650-41-001000

115-93-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2901 QRF
- +

  카트에 추가

  지금 질의

115-93-650-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-650-41-001000

115-43-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3834 QRF
- +

  카트에 추가

  지금 질의

115-43-650-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-324-41-003000

126-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2469 QRF
- +

  카트에 추가

  지금 질의

126-93-324-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-424-41-003000

126-93-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2840 QRF
- +

  카트에 추가

  지금 질의

126-93-424-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-624-41-003000

126-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2796 QRF
- +

  카트에 추가

  지금 질의

126-93-624-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-324-41-003000

126-43-324-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3457 QRF
- +

  카트에 추가

  지금 질의

126-43-324-41-003000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-424-41-003000

126-43-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2899 QRF
- +

  카트에 추가

  지금 질의

126-43-424-41-003000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-624-41-003000

126-43-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2125 QRF
- +

  카트에 추가

  지금 질의

126-43-624-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-3503-20

32-3503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3928 QRF
- +

  카트에 추가

  지금 질의

32-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-3503-30

32-3503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3265 QRF
- +

  카트에 추가

  지금 질의

32-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-3551-10

32-3551-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2539 QRF
- +

  카트에 추가

  지금 질의

32-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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