> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-328-41-003000

116-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3623 QRF
- +

  카트에 추가

  지금 질의

116-93-328-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-428-41-003000

116-93-428-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3947 QRF
- +

  카트에 추가

  지금 질의

116-93-428-41-003000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-628-41-003000

116-93-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2866 QRF
- +

  카트에 추가

  지금 질의

116-93-628-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-764-41-005000

117-91-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2492 QRF
- +

  카트에 추가

  지금 질의

117-91-764-41-005000

Datasheet

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-820-90CTL

16-820-90CTL

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3859 QRF
- +

  카트에 추가

  지금 질의

16-820-90CTL

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
517-87-372-19-111111

517-87-372-19-111111

CONN SOCKET PGA 372POS GOLD

Preci-Dip

3821 QRF
- +

  카트에 추가

  지금 질의

517-87-372-19-111111

Datasheet

Bulk 517 Active PGA 372 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-640-41-006000

116-41-640-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3528 QRF
- +

  카트에 추가

  지금 질의

116-41-640-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-6511-11

30-6511-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2178 QRF
- +

  카트에 추가

  지금 질의

30-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0511-11

11-0511-11

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2307 QRF
- +

  카트에 추가

  지금 질의

11-0511-11

Datasheet

Bulk 511 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-0501-21

19-0501-21

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3000 QRF
- +

  카트에 추가

  지금 질의

19-0501-21

Datasheet

Bulk 501 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-0501-31

19-0501-31

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2079 QRF
- +

  카트에 추가

  지금 질의

19-0501-31

Datasheet

Bulk 501 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6621-30

16-6621-30

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3393 QRF
- +

  카트에 추가

  지금 질의

16-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-620-41-105000

117-43-620-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2731 QRF
- +

  카트에 추가

  지금 질의

117-43-620-41-105000

Datasheet

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-324-41-780000

104-13-324-41-780000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3473 QRF
- +

  카트에 추가

  지금 질의

104-13-324-41-780000

Datasheet

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-424-41-780000

104-13-424-41-780000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3175 QRF
- +

  카트에 추가

  지금 질의

104-13-424-41-780000

Datasheet

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
116-43-328-41-003000

116-43-328-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3456 QRF
- +

  카트에 추가

  지금 질의

116-43-328-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-428-41-003000

116-43-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3756 QRF
- +

  카트에 추가

  지금 질의

116-43-428-41-003000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-628-41-003000

116-43-628-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2411 QRF
- +

  카트에 추가

  지금 질의

116-43-628-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-320-41-002000

124-41-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2787 QRF
- +

  카트에 추가

  지금 질의

124-41-320-41-002000

Datasheet

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-420-41-002000

124-41-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2701 QRF
- +

  카트에 추가

  지금 질의

124-41-420-41-002000

Datasheet

Tube 124 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 449450451452453454455456...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사