> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-93-632-31-002000

614-93-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3011 QRF
- +

  카트에 추가

  지금 질의

614-93-632-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-7438-10

21-7438-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

3894 QRF
- +

  카트에 추가

  지금 질의

21-7438-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-7530-10

21-7530-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

2434 QRF
- +

  카트에 추가

  지금 질의

21-7530-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-7562-10

21-7562-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

2491 QRF
- +

  카트에 추가

  지금 질의

21-7562-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6823-90

22-6823-90

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3151 QRF
- +

  카트에 추가

  지금 질의

22-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
26-6823-90T

26-6823-90T

CONN IC DIP SOCKET 26POS TIN

Aries Electronics

2281 QRF
- +

  카트에 추가

  지금 질의

26-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
116-93-320-41-001000

116-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3955 QRF
- +

  카트에 추가

  지금 질의

116-93-320-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-420-41-001000

116-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2929 QRF
- +

  카트에 추가

  지금 질의

116-93-420-41-001000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-320-41-001000

116-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2781 QRF
- +

  카트에 추가

  지금 질의

116-43-320-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-420-41-001000

116-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3118 QRF
- +

  카트에 추가

  지금 질의

116-43-420-41-001000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-322-41-001000

121-11-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3246 QRF
- +

  카트에 추가

  지금 질의

121-11-322-41-001000

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-422-41-001000

121-11-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2875 QRF
- +

  카트에 추가

  지금 질의

121-11-422-41-001000

Datasheet

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-114-13-062101

550-10-114-13-062101

PGA SOLDER TAIL

Preci-Dip

2640 QRF
- +

  카트에 추가

  지금 질의

550-10-114-13-062101

Datasheet

Bulk 550 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
127-41-430-41-003000

127-41-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2573 QRF
- +

  카트에 추가

  지금 질의

127-41-430-41-003000

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-430-41-003000

127-91-430-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2946 QRF
- +

  카트에 추가

  지금 질의

127-91-430-41-003000

Datasheet

Tube 127 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-650-41-105000

110-93-650-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3010 QRF
- +

  카트에 추가

  지금 질의

110-93-650-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-950-41-105000

110-93-950-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2214 QRF
- +

  카트에 추가

  지금 질의

110-93-950-41-105000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-650-41-105000

110-43-650-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2037 QRF
- +

  카트에 추가

  지금 질의

110-43-650-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-950-41-105000

110-43-950-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3545 QRF
- +

  카트에 추가

  지금 질의

110-43-950-41-105000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-652-41-006000

116-41-652-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3613 QRF
- +

  카트에 추가

  지금 질의

116-41-652-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 434435436437438439440441...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사