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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
917-43-104-41-005000

917-43-104-41-005000

CONN TRANSIST TO-5 4POS GOLD

Mill-Max Manufacturing Corp.

728 QRF
- +

  카트에 추가

  지금 질의

917-43-104-41-005000

Datasheet

Tube 917 Active Transistor, TO-5 4 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
SA406040

SA406040

CONN IC DIP SOCKET 40POS GOLD

On Shore Technology Inc.

185 QRF
- +

  카트에 추가

  지금 질의

SA406040

Datasheet

Tube SA Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled
ICM-648-1-GT-HT

ICM-648-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 48P

Adam Tech

851 QRF
- +

  카트에 추가

  지금 질의

ICM-648-1-GT-HT

Datasheet

Tube ICM Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
D0808-42

D0808-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

159 QRF
- +

  카트에 추가

  지금 질의

D0808-42

Datasheet

Bulk D0 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
44-547-11

44-547-11

CONN SOCKET SOIC ZIF 44POS GOLD

Aries Electronics

3649 QRF
- +

  카트에 추가

  지금 질의

44-547-11

Datasheet

Bulk 547 Active SOIC, ZIF (ZIP) 44 (2 x 22) - Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 20.0µin (0.51µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
317-47-108-41-005000

317-47-108-41-005000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

128 QRF
- +

  카트에 추가

  지금 질의

317-47-108-41-005000

Datasheet

Tube 317 Active SIP 8 (1 x 8) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-424-41-001000

110-99-424-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

252 QRF
- +

  카트에 추가

  지금 질의

110-99-424-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-318-41-003000

115-47-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

194 QRF
- +

  카트에 추가

  지금 질의

115-47-318-41-003000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-314-01-670800

214-99-314-01-670800

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.

195 QRF
- +

  카트에 추가

  지금 질의

214-99-314-01-670800

Datasheet

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-628-41-001000

210-47-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

121 QRF
- +

  카트에 추가

  지금 질의

210-47-628-41-001000

Datasheet

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-210-10-001000

110-43-210-10-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

3051 QRF
- +

  카트에 추가

  지금 질의

110-43-210-10-001000

Datasheet

Tube 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-99-318-01-670800

214-99-318-01-670800

CONN IC DIP SOCKET 18POS TINLEAD

Mill-Max Manufacturing Corp.

417 QRF
- +

  카트에 추가

  지금 질의

214-99-318-01-670800

Datasheet

Tube 214 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
PLCC-52-AT

PLCC-52-AT

PLCC 52P THROUGH HOLE

Adam Tech

275 QRF
- +

  카트에 추가

  지금 질의

PLCC-52-AT

Datasheet

Tube PLCC Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
8444-21A1-RK-TP

8444-21A1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

831 QRF
- +

  카트에 추가

  지금 질의

8444-21A1-RK-TP

Datasheet

Tube 8400 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8452-21A1-RK-TP

8452-21A1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

581 QRF
- +

  카트에 추가

  지금 질의

8452-21A1-RK-TP

Datasheet

Tube 8400 Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
110-43-422-41-001000

110-43-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

267 QRF
- +

  카트에 추가

  지금 질의

110-43-422-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
PLCC-68-AT

PLCC-68-AT

PLCC 68P THROUGH HOLE

Adam Tech

1216 QRF
- +

  카트에 추가

  지금 질의

PLCC-68-AT

Datasheet

Tube PLCC Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
XR2C1011N

XR2C1011N

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

353 QRF
- +

  카트에 추가

  지금 질의

XR2C1011N

Datasheet

Bulk XR2 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
110-99-640-41-001000

110-99-640-41-001000

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.

593 QRF
- +

  카트에 추가

  지금 질의

110-99-640-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-308-41-001000

123-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

765 QRF
- +

  카트에 추가

  지금 질의

123-93-308-41-001000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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