> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-628-41-001000

110-91-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3171 QRF
- +

  카트에 추가

  지금 질의

110-91-628-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-306-41-001000

110-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3440 QRF
- +

  카트에 추가

  지금 질의

110-93-306-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-306-41-001000

110-99-306-41-001000

CONN IC DIP SOCKET 6POS TIN-LEAD

Mill-Max Manufacturing Corp.

3690 QRF
- +

  카트에 추가

  지금 질의

110-99-306-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-306-41-001000

110-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2128 QRF
- +

  카트에 추가

  지금 질의

110-41-306-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-314-G-M

APA-314-G-M

ADAPTER PLUG

Samtec Inc.

3569 QRF
- +

  카트에 추가

  지금 질의

Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
40-6513-11

40-6513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3464 QRF
- +

  카트에 추가

  지금 질의

40-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-11

26-3513-11

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2610 QRF
- +

  카트에 추가

  지금 질의

26-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-93-624-10-002000

299-93-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2659 QRF
- +

  카트에 추가

  지금 질의

299-93-624-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-624-10-002000

299-43-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3466 QRF
- +

  카트에 추가

  지금 질의

299-43-624-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
29-0511-10

29-0511-10

CONN SOCKET SIP 29POS TIN

Aries Electronics

3353 QRF
- +

  카트에 추가

  지금 질의

29-0511-10

Datasheet

Bulk 511 Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-11H

22-4513-11H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2369 QRF
- +

  카트에 추가

  지금 질의

22-4513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-20

18-3503-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3783 QRF
- +

  카트에 추가

  지금 질의

18-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-30

18-3503-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3808 QRF
- +

  카트에 추가

  지금 질의

18-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0511-10

40-0511-10

CONN SOCKET SIP 40POS TIN

Aries Electronics

3692 QRF
- +

  카트에 추가

  지금 질의

40-0511-10

Datasheet

Bulk 511 Active SIP 40 (1 x 40) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-642-41-004101

116-83-642-41-004101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3037 QRF
- +

  카트에 추가

  지금 질의

116-83-642-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-150-41-013000

346-93-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

2106 QRF
- +

  카트에 추가

  지금 질의

346-93-150-41-013000

Datasheet

Bulk 346 Active SIP 50 (1 x 50) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-150-41-013000

346-43-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

3422 QRF
- +

  카트에 추가

  지금 질의

346-43-150-41-013000

Datasheet

Bulk 346 Active SIP 50 (1 x 50) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-822-90T

14-822-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2789 QRF
- +

  카트에 추가

  지금 질의

14-822-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-6820-90TWR

18-6820-90TWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3682 QRF
- +

  카트에 추가

  지금 질의

18-6820-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-134-31-018000

714-43-134-31-018000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

2044 QRF
- +

  카트에 추가

  지금 질의

714-43-134-31-018000

Datasheet

Bulk 714 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Records«Prev1... 261262263264265266267268...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사